Thin film circuit board

Abstract

Abstract PURPOSE:To perform an automatic generation of a dummy wiring by using pads for wiring as dummy wiring connection pads when the dummy wiring is automatically generated by providing placing pads and the wiring pads provided at 1:1 to the placing pads, and cutting the connection pattern of a surface layer if a thin film circuit board is modified upon alteration of logics to modify the board. CONSTITUTION:Placing pads 2 are provided on a thin film circuit board 1, and wiring pads 3 are further provided at 1:1 to the pads 2. A dummy wiring 4 and general wirings 4 are all connected to the pads 3. If the wiring 4 is connected to the pad 3, the pad 2 is not connected to the pad 3. If general wiring 5 is connected to the pad 4, the pad 2 is connected to the pad 3 on the surface layer by a connection pattern 6.

Inventors

• 👤 Tatsuo Matsushita
• 👤 松下　達男

Bibliographic Details