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JPH03219620A Expired / Lapsed JP ⏱️ 0.0 years remaining

Plasma ashing apparatus

Assignee: Sharp Corp
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Filing: 1990-01-24
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Granted: —
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Expires: 2010-01-24
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Abstract

Abstract PURPOSE:To enhance the exfoliation property of a resist and to realize an ashing operation without damage by a method wherein the distance between a plasma generation part and a reaction part on which a substrate to be treated has been mounted is controlled. CONSTITUTION:An induction coil 4 used to generate a plasma is moved up and down along a cylindrical-trunk wall surface. Thereby, a plasma generation part 5 which generates a high-frequency glow can be moved close to or away from a substrate 3 to be treated. When an ashing operation whose ionicity is strong in order to remove a denatured organic resist layer 1a is required, the induction coil 4 is moved downward and is brought close to the substrate 3 to be treated. In other cases, the induction coil 4 is moved upward from the substrate 3 to be treated and is moved away from the substrate 3 to be treated. As a means to control a distance at this operation, the induction coil 4 is moved by the instruction of a microcomputer according to a program by which its position has been set in advance.

Inventors

  • 👤 Ryohei Kawabata
  • 👤 川端 良平

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-08 11:19
CPC Classifications
—

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