Resin composition and resin-sealed electronic device produced by using the composition

Abstract

Abstract PURPOSE:To obtain the subject composition effective in improving the adhesivity a filler to a matrix resin and the high-temperature strength of a molded article and useful for a resin-sealed semiconductor device by compounding a specific amount of spherical inorganic filler coated with a silane coupling agent. CONSTITUTION:A spherical inorganic filler coated with a silane coupling agent (preferably vinyltriethoxysilane) is produced by spraying a slurry containing 100 pts.wt. of a spherical inorganic filler (preferably spherical silica of 0.5-100mum diameter), preferably 0.1-3 pts.wt. of the silane coupling agent and a solvent (e.g. water) into a reduced-pressure atmosphere heated at or above the boiling point of the solvent. The objective composition can be produced by compounding >=70wt.% of the spherical inorganic filler with a matrix resin (e.g. epoxy resin), a curing agent, a cure accelerator and, as necessary, a plasticizer, etc. A resin- sealed semiconductor device having improved crack resistance is produced by using the composition as a sealing material.

Inventors

• 👤 Hiroyuki Hozoji
• 👤 裕之 宝蔵寺
• 👤 Masaji Ogata
• 👤 正次 尾形
• 👤 Kuniyuki Eguchi
• 👤 州志 江口
• 👤 Masanori Segawa
• 👤 正則 瀬川
• 👤 Osamu Horie
• 👤 修 堀江

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