Production device for semiconductor

Abstract

Abstract PURPOSE:To improve reliability in the treatment of a semiconductor substrate and working efficiency by installing a reaction vessel, in which the substrate is housed in a retractable manner, and a heating equipment mounted around the reaction vessel in retractable manner and inserting a pipe body supplying an etching gas into the reaction vessel. CONSTITUTION:A cylindrical body 21 containing a heater 22 as a heating equipment is set up around a reaction vessel 5, and held on a rail 23 in freely elevating/lowering manner through a backing ring 24. Pipe bodies 25 supplying an etching gas into the reaction vessel 5 are inserted and fixed to a lower bottomed cylindrical body 9 in both bottomed cylindrical bodies 8, 9. Consequently, the etching gas can be fed into the reaction vessel 5 under the state in which the heater 22 is forwarded or retreated to an upper section from the reaction vessel 5. Accordingly, increase of electric resistance due to formation of a conductive film is suppressed, thus improving reliability in the treatment of a substrate. The heating time of the reaction vessel 5 can be shortened by the heating equipment 22 previously held at a high temperature after discharge of the etching gas, thus enhancing working efficiency.

Inventors

• 👤 Kiyoteru Kobayashi
• 👤 清輝 小林

Bibliographic Details