Distribution type pressure sensor

Abstract

Abstract PURPOSE:To decompose load in three-axis direction to detect the same by a method wherein two or more sets of rectangular piercing holes forming pairs are provided to a semiconductor substrate in directions crossing at a right angle and beams are provided between said holes while projections are formed in the centers of the beams and strain gauges are provided on the beam parts on the other surface of the substrate. CONSTITUTION:Two X-direction beams 40 and two Y-direction beams 41 are provided to a Si-substrate by eight rectangular piercing holes 33 and semiconductor strain gauges 42 are formed on the beams and a signal processing part 30B is formed to the right-hand half surface of the substrate. A projections is provided at the center of the span of each beam and thin wall parts are formed on both sides thereof and strain gauges are constituted on each beam part on the other surface of the substrate. By this constitution, a large number of the strain gauges are arranged so as to be limited to the center lines along the longitudinal directions of the beams boundary cross-sectional positions of the thin wall parts on the parallel lines drawn to the symmetric positions on both sides of said center lines and the beam support parts and the cross-sectional positions along both ends of the projection parts. Therefore, as a distribution type pressure sensor 30, the component forces of the applied load widely acting on a surface in three-dimensional directions can be detected with high density distribu tion.

Inventors

• 👤 Tomonori Katano
• 👤 智紀 片野

Bibliographic Details