Microwave band integrated circuit

Abstract

Abstract PURPOSE:To increase the degree of freedom in design by arranging an ground bonding pad on the center of a curved shape formed on one end of a short stub and connecting the pad to the stub through a conductor. CONSTITUTION:The short stub 5 is rectangularly formed and the ground bonding pad 6 constituted of a via hole is formed approximately on the center part of the rectangular area. The length of the stub 5 is adjusted by selecting the connecting position of the other end of a bonding wire 7 connected to the pad 6 at its one end on the stub 5. Although the length of the wire 7 is changed in accordance with the connecting positions E1, E2, E3, the load of mask formation at the time of producing a program or an integrated circuit whose pattern is designed by a CAD system or the like can be reduced because the pattern of the stub 5 can be linearly constituted. Consequently, the degree of freedom in design is increased, the characteristics of an integrated circuit can be improved and its application range can be expanded.

Inventors

• 👤 Keiichi Sakuno
• 👤 圭一 作野

Bibliographic Details