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JPH026387A Expired / Lapsed JP ⏱️ 0.0 years remaining

Method for forming thin film

Assignee: Fujitsu Ltd
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Filing: 1988-06-09
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Granted: —
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Expires: 2008-06-09
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Abstract

Abstract PURPOSE:To enable improvement in crystallinity of a formed thin film by intermittently carrying out growth operation of the abovementioned thin film in forming the thin film of a substance having a lattice constant different from that of a semiconductor constituting a substrate on the surface of a semiconductor substrate by a hetero.epitaxial growth method. CONSTITUTION:Thin films 2 and 3 of a substance (e.g., SiC) having a lattice constant different from that of a semiconductor constituting a semiconductor substrate 1 (e.g., Si substrate) are formed on the surface of the substrate 1 by a hetero.epitaxial growth method. In the process, the following constitution is adopted. That is the substance 2 having the lattice constant different from that of the semiconductor constituting the substrate 1 is grown to a prescribed thickness and the growth is then once stopped. A step for growing the substance 3 having the lattice constant different from that of the semiconductor constituting the substrate 1 to a prescribed thickness is further repeated once or plural times.

Inventors

  • 👤 Masao Yamada
  • 👤 雅雄 山田

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-07 22:31
CPC Classifications
—

Claims Analysis

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References Cited (Backward Citations)

JPS59203799A Cited
JPS61222992A Cited
JPS6230699A Cited

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