Cooling apparatus

Abstract

Abstract PURPOSE:To efficiently remove a coolant vapor air bubble inside a coolant flow route and to prevent a drop in a cooling capacity in a downstream part of the coolant flow route by a method wherein a plurality of pins, for air-bubble suction use, used to suck an air bubble which is generated from the surface of a semiconductor element and which is contained in a coolant liquid are installed in a downstream position of the semiconductor element inside the coolant flow route. CONSTITUTION:A coolant flow route 101 is connected to a heat exchanger via a circulating pump; a coolant liquid 103 is circulated inside the coolant flow route 101 by this system. In addition, also coolant vapor air bubbles 105 which have been sucked by pins 106 for air- bubble suction use are liquefied; after that, the air bubbles are again fed into the coolant flow route 101 by using the circulating pump. The pins 106, for air-bubble suction use, of, e.g., three pieces per semiconductor element chip are installed in a downstream position of a semiconductor element 102 inside the coolant flow route 101. Thereby, since the air bubbles 105 generated by heat of the semiconductor element 102 are sucked on the downstream side of the semiconductor element 102; the air bubbles 105 existing inside the coolant flow route 101 are small, and a cooling capacity in the downstream part of the coolant flow route 101 is not caused. Accordingly, the semiconductor element 102 which generates high heat can be cooled.

Inventors

• 👤 Mitsutaka Yamada
• 👤 光隆 山田
• 👤 Kishio Yokouchi
• 👤 貴志男 横内

Bibliographic Details