Soldering of electronic component

Abstract

Abstract PURPOSE:To make a pin to be positioned in the center of a prescribed pad at the time of soldering by a method wherein a metallized dam, which consists of a material generating no solder wetting while being formed on the same surface with the solder fixing surface, is formed in the central part of a pad, while melting of solder is performed by making a tip part to contact with the metallized dam. CONSTITUTION:The surface of a metallized dam is formed so as to be the same surface with the solder fixing surface of a pad 2 and the surface of the metallized dam 6 is made not to generate solder wetting. Thereby, a movement is made to swell round the metallized dam 6 as a center while being melted and the tip part 4A is fixed in the center of the pad 2 by solder. Accordingly, even in case positioning is made in such a state, wherein the tip 4A of the pin 4 does not abut on metallized dam 6 but abut on the laminated solder 5. Accordingly, the positioning is performed according to the periphery of the electronic component and the center C1 of the pin 4 does not agree with the center C2 of the pad 2, the center C1 of the pin 4 is moved in the arrow direction by melting of solder 5 to perform a movement so that the center C1 may agree with the center 2.

Inventors

• 👤 Mitsuo Suehiro
• 👤 光男 末廣

Bibliographic Details