Semiconductor device

Abstract

Abstract PURPOSE:To facilitate the distinction of semiconductor devices and the confirmation of leads by forming a package of a plurality of the same circuits packaged in series in one resin mold and arranging marks corresponding to each circuit on the package to be cut by one or a plurality of circuits. CONSTITUTION:A semiconductor device comprises a package 1 in which, for example, the same six circuits are arranged in series and integrally molded. Cutting the package 1 at the broken lines provides up to six semiconductor devices. Marks 3 are formed at the parts, corresponding to each circuit, of the upper surface of the package 1. For example, when the package 1 is cut by one circuit, one mark 3 exists on the upper surface of each package, and when the package 1 is cut by two circuits, two marks 3 exist on the upper surface of each package. The number of the circuits can be confirmed by confirming the number of the marks 3 to enable the judgement of the sort thereof.

Inventors

• 👤 Kazutoyo Akase
• 👤 赤瀬　一豊

Bibliographic Details