Lead frame and semiconductor device consisting of lead frame therefor and manufacture thereof

Abstract

Abstract PURPOSE:To house a large semiconductor element in a small package and contrive a high integration of a semiconductor device by disposing internal leads on the semiconductor element after forming a die pad and leads separately by the use of double lead frames. CONSTITUTION:A semiconductor element 11 is located and fixed on a die pad part 12. Internal leads 13 extend inside on the upper face of the element 11 and, through bonding wires 15, the internal leads are connected to electrodes 14 which are installed at the pointed ends of the leads 13 and at peripheral parts of the element 11 and are corresponding to the leads 13. The whole body is sealed with a resin and the sealing resin exists between the lower face of leads 13 and the surface of the element 11. It is sufficient for the width C of the element 11 which is sealed inside of an envelope having a width N to satisfy the relationship of C<N-alpha' where (alpha') represents margin of dimension. However, as the value of (alpha') becomes small in comparison with that of N, the value of N approaches considerably the value of C and then, scalling up of the element is obtained. Such a state of the element contrives a high integration of a semiconductor device.

Inventors

• 👤 Yasuhiro Yamaji
• 👤 泰弘 山地
• 👤 Kenji Takahashi
• 👤 健司 高橋
• 👤 Hisaharu Sakurai
• 👤 桜井　寿春
• 👤 Masashi Muromachi
• 👤 室町　正志
• 👤 Hiroshi Harada
• 👤 博 原田
• 👤 Kazuichi Yonenaka
• 👤 米中　一市
• 👤 Susumu Harada
• 👤 享 原田
• 👤 Mitsugi Miyamoto
• 👤 宮本　貢
• 👤 Kazuo Numajiri
• 👤 一男 沼尻
• 👤 Haruyuki Shimakawa
• 👤 島川　晴之

Bibliographic Details