Semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To obtain a semiconductor integrated circuit device having each lead wiring which does not break or bend very much by causing the width of a package upper part to be wider than that of a package lower part so that each lead wiring is protected. CONSTITUTION:Forming a package, a mold resin 1 is divided into upper and lower parts a2 and b2 by lead wiring 4 and the width of the upper part is constructed to be wider than that of the lower part. As each lead wiring is protected by the upper part of the resin 1, no lead wiring is affected directly by stress and it does not bend or break. A semiconductor integrated circuit device having each lead wiring which does not bend or break very much is thus obtained.

Inventors

• 👤 Mitsuharu Ishibashi
• 👤 光治 石橋
• 👤 Masayuki Yamashita
• 👤 山下　正之
• 👤 Tatsuki Koshiyou
• 👤 古庄　辰記

Bibliographic Details