Housing of semiconductor substrate

Abstract

Abstract PURPOSE:To keep one side surface of a semiconductor substrate from coming into contact with the substrate guide of a housing and prevent the matter of quality from becoming a serious problem by making the substrate guide of the housing have an inclination from a vertical position to an installation face. CONSTITUTION:The configuration of this housing allows the thickness of a handle side 1 up to an installation face 7 of the inclined base part 3 to be thicker than that of the side of a side face part 2a and an insertion groove 5 where its substrate is housed is slanted to the installation face 7. In this way, although only a left side face of all semiconductor substrates has a possibility to come into contact with a substrate guide, a right side face thus does not come into contact with the substrate guide. Then, even though the surface is coated with a photoresist layer before being treated by thermosetting, its surface is not stained and is not damaged as well. Such a surface thus prevents the matter of quality from becoming a serious problem.

Inventors

• 👤 Keiichi Sugiura
• 👤 杉浦　恵一

Bibliographic Details