Manufacture of photoelectric conversion element molded with transparent resin

Abstract

Abstract PURPOSE:To completely reject stray light or random light coming from parts other than a photoelectric conversion element photodetecting surface serving as a sensor and thereby improve photoelectric conversion characteristics by a method wherein a protrusion is provided on a transparent resin at a location corresponding to the photodetecting surface, molding is accomplished, and then another molding is accomplished using a non-translucent resin film, and the part of the non-translucent resin covering the protrusion is removed by abrasion. CONSTITUTION:In a device wherein a photoelectric conversion element installed on a mount 1 and connected to outer leads 2 is molded in a transparent resin 6, a protrusion 8 is provided on the transparent resin 6 at a location corresponding to the photodetecting surface of the photoelectric conversion element, and the transparent resin 6 including the protrusion 8 is molded in a translucent resin 9, and then a part 9a of the non-translucent resin 9 covering the protrusion 8 is removed by abrasion for the formation of an opening 10. For example, on the mount 1 of a lead frame 3, a semiconductor integrated circuit element 4 consisting of a photoelectric conversion element and its peripheral circuits is installed, and it is so arranged that light will fall only upon the photodetecting surface corresponding to the photoelectric conversion element constituting a part of the semiconductor integrated circuit element 4.

Inventors

• 👤 Sadamichi Toi
• 👤 戸井　貞道

Bibliographic Details