High density mounting printed board

Abstract

Abstract PURPOSE:To reduce in size an electronic device by inverting a flat package component to a rear side, inserting it into a component insertion hole formed on a printed board, and mounting it. CONSTITUTION:An FPIC insertion hole 5 formed in a profile of an intermediate vertical part of the lead terminal 2 of a first flat package IC(FPIC) and a pad 4 for soldering the lead terminal of the FPIC to be inserted to the peripheral edge of the hole 5 are provided on a printed board 3. The IC 1 is inverted to its rear side, inserted into the hole 5, and the terminal 2 is soldered to the pad 4. A second FPIC 6 which is larger than the profile of the IC 1 is soldered to a second FPIC pad 8 provided on its outside from the pad 4 of the board 3 with the lead terminal 7 of the IC 6 by a normal mounting method with the front side of the IC as the upper face. The IC 2 of small size is stereoscopically mounted in the occupying area of the board 3 of large size by such a mounting method to reduce the occupying area of the board 3.

Inventors

• 👤 Shigeyuki Ogata
• 👤 尾形　繁行
• 👤 Toshiyasu Takei
• 👤 武井　利泰

Bibliographic Details