Surface mounting type resin seal type semiconductor device

Abstract

Abstract PURPOSE:To reduce the vaporization pressure under a high temperature at the time of soldering mounting, and restrain the increase of expansion stress by forming a resin film having high adhesion to both of a lead frame and sealing resin, on the rear of an island part. CONSTITUTION:A semiconductor chip 1 is mounted on the main surface of an island part 2 of a lead frame 4, and sealed with first resin 3. At this time, a film 6 of second resin is stuck on the rear of the island part 2 of the lead frame 4. The film 6 is a polyimide system film. As a result, when a package absorbs moisture, the water content does not concentrate on the interface between the island part 2 of the frame 4 and the film 6, and the interface between the film 6 and the resin 3. Thereby, the vaporization pressure at a high temperature at the time of soldering mounting is reduced, and the increase of expansion stress can be restrained.

Inventors

• 👤 Kazuya Fujita
• 👤 和弥 藤田
• 👤 Kayoko Uemura
• 👤 植村　加代子

Bibliographic Details