Semiconductor device

Abstract

Abstract PURPOSE:To absorb and soften stress generated at a solder bump connection by the deformation property of a flexible wiring board so as to enable deterioration of the connection to be prevented by mounting a semiconductor element which has a solder bump electrode on the flexible wiring board which coates a wiring layer with a resin film so as to constitute a module. CONSTITUTION:A flexible wiring board 1 is constituted of a wiring layer 2 consisting of film conductive material such as copper, etc., and a resin film 3 covering this wiring layer 2. And at a position a little to the center of the surface of the flexible wiring board 1 is formed an element mount pad electrode 4 which continued to the wiring layer and exposed the surface, and at a position a little to the periphery of the reverse is formed an external connection pad electrode 5 which continued to the wiring layer 2 and exposed the surface. And by connecting a semiconductor element 11 having a solder bump electrode 12 to the element mounted pad electrode 4, the semiconductor element 11 is mounted to the flexible wiring board 1 so as to constitute a module.

Inventors

• 👤 Yoshifumi Moriyama
• 👤 森山　好文
• 👤 Shinya Yoshioka
• 👤 吉岡　伸哉

Bibliographic Details