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JPH0230397A Expired / Lapsed JP ⏱️ 0.0 years remaining

Flux composition for soldering

Assignee: Nihon Handa Co Ltd
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Filing: 1988-07-20
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Granted: —
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Expires: 2008-07-20
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Abstract

Abstract PURPOSE:To make it possible to use a flux compsn. without washing after soldering by allowing isophthalic acid (deriv.) and/or phthalic acid (deriv.) to react with specified glycols and by incorporating the resulting ester compd. and a flux activator. CONSTITUTION:Isophthalic acid (deriv.) and phthalic acid (deriv.) are allowed to react with glycols represented by formulae I, II and the resulting ester compd. and a flux activator are incorporated into a flux compsn. for soldering. The molar ratio of the dicarboxylic acid components to the glycol components in the ester compd. is preferably regulated to 1:1.2-1:2.2. A satisfactory flux compsn. solving various problems caused by using a known base such as rosin or PEB (pentaerythritol tetrabenzoate) even when used without washing after soldering is obtd. The problems include a change between lots, moisture absorption, deterioration of electric insulating property, corrosion of a peripheral part, stickiness and crystallization.

Inventors

  • 👤 Kenji Asami
  • 👤 浅見 健次
  • 👤 Keizo Kobayashi
  • 👤 慶三 小林

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-03 19:32
CPC Classifications
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