Flattening method for transparent electrode

Abstract

Abstract PURPOSE:To flatten ruggedness of a transparent electrode at a low cost by covering the electrode with a metal and applying a photoresist to thickness of the electrode, executing an ultraviolet-ray exposure, and thereafter, eliminating the metal by etching. CONSTITUTION:A transparent electrode 2 of an ITO, etc. on a transparent substrate 1 is covered with a metallic layer of Ni-P, etc., by electroplating, etc. Subsequently, a permanent type negative type photoresist is applied to almost the same thickness as the transparent electrode 2, ultraviolet rays irradiate the reverse side of the substrate 1, only a part through which light beams transmit and an unexposed part is peeled off. Thereafter, the exposed metallic part is eliminated by etching. As a result, the electrode surface can be flattened to 2,500Angstrom + or -100Angstrom , and a liquid crystal panel in which there is no color shading and no domain exists, and which is in a uniform oriented state can be formed.

Inventors

• 👤 Kaname Miyazawa
• 👤 宮澤　要

Bibliographic Details