Resin-sealed semiconductor device

Abstract

Abstract PURPOSE:To obtain a good heat-dissipating characteristic to dissipate heat generated at a semiconductor element to the air without damaging a moistureproof property of a semiconductor device, to realize a high integration of the semiconductor element and to realize a high-density mounting operation of the semiconductor device by a method wherein a protruding part is formed at the semiconductor element and its tip face is exposed from a sealing resin. CONSTITUTION:A plurality of leads 3 are extracted to the outside from two directions of a resin-sealed type semiconductor device. A protruding part 9 is formed on a face 1a opposite to a face on which an electrode group 2 of a semiconductor element 1 has been formed; it is sealed with a resin in such a way that a tip face 9a of the protruding part 9 is exposed. Thereby, a creeping route of moisture from this part can be made long; the moisture creeping into the semiconductor device can be reduced; it is possible to prevent an electrode part from being corroded or the like; it is possible to dissipate heat generated at the semiconductor element to the air without damaging a moistureproof property of the semiconductor device; a high integration of the semiconductor element can be realized; a high-density mounting operation can be realized.

Inventors

• 👤 Akihiro Yaguchi
• 👤 昭弘 矢口
• 👤 Asao Nishimura
• 👤 西村　朝雄
• 👤 Makoto Kitano
• 👤 誠 北野
• 👤 Chikako Kitabayashi
• 👤 北林　千加子
• 👤 Sueo Kawai
• 👤 末男 河合

Bibliographic Details