Polishing pad

Abstract

Abstract PURPOSE:To greatly improve polishing efficiency of a polishing pad with extremely reduced times of regenerating work through cutting its surfaces, by filling a foaming polyurethane material with a fine granular object of less than 30mu grain size having hardness higher than that of polyurethane. CONSTITUTION:A fine granular object of 300mu or less fine grain size, not containing an element giving a bad influence to the electric characteristic in forming a semiconductor element for a semiconductor wafer especially for a silicone wafer, is added 0.5 to 50% by volume to a foaming polyurethane material and dispersed. Next this material is poured into a mold and foam hardened, thereafter machine work is performed to form the material into a sheet state so as to obtain a desired polishing pad.

Inventors

• 👤 Yoshitane Shigeta
• 👤 好胤 繁田

Bibliographic Details