Electronic device housing using heat pipe unit

Abstract

Abstract PURPOSE:To compactly compose an electronic device housing by providing an air inlet at the lower part of a duct and an air discharge fan at the upper part, mounting to laterally dispose a heat pipe unit at the upper position in the housing, and allowing the condensing part of the pipe to protrude from a partition wall into the duct. CONSTITUTION:A duct 6 of a wide and small longitudinal distance opposed at the whole face to a rear face plate 3 is composed of a partition wall 4, and the top of the wall 4 is bent forward to increase the duct 6 upward. An air inlet 7 is attached to the lower part of the plate 3, and an air discharge fan 9 is attached to the upper face plate 3 of the housing 2, the inlet 7 is provided at the lower part of the duct 6, and the air discharge fan 9 is provided at the upper part. A heat pipe unit 1 is so laterally disposed that the longitudinal direction of the heat pipe is lateral and the thicknesswise direction is longitudinal, a condensing part 10 protrudes into the duct 6, and an evaporator 11 is mounted at a containing space 5. Thus, cooling capacity is increased, and the containing space can be relatively increased, and it can be compactly composed.

Inventors

• 👤 Tadayoshi Onuki
• 👤 大貫　忠良
• 👤 Hiroshi Kondo
• 👤 博 近藤

Bibliographic Details