Manufacture of circuit device

Abstract

Abstract PURPOSE:To manufacture a circuit device in which a resin coating layer can be formed in a region limited without damaging wirings by coating a semiconductor chip and the wirings with a photoset resin, setting the limited region containing the chip and the wirings by radiating it with light, and then removing the uncured part. CONSTITUTION:An epoxy ultraviolet-ray curable resin 9 so coats from a dispenser as to cover a semiconductor chip 2 and wirings 4. Then, with a mask 10 used the covering region of the chip 2 and the wirings 4 of the resin 9 is irradiated with ultraviolet rays 13 to be cured. Thereafter, the uncured part of the resin 9 is dissolved and removed with xylene, then heat treated at 120 deg.C for 60min thereby to obtain a resin coating layer 9a made of cured resin.

Inventors

• 👤 Noboru Oki
• 👤 大木　昇

Bibliographic Details