Manufacture of cooling substrate for electronic part

Abstract

Abstract PURPOSE:To prevent the formation of a gold and/or silver plating layer on the surface brought into contact with a refrigerant, and to improve cooling efficiency by plating a non-photo-resist layer section with gold and/or silver, peeling a photo-resist and etching it. CONSTITUTION:A photo-resist is applied onto the surface (one surface or both surfaces) on the forming side of the refrigerant flow paths 2, 2a, 2b of a metallic plate 1, and photo-resist films 3 with specified patterns are formed through drying, exposure and development. Non-photo-resist layer sections are plated with gold and/or silver, but the thickness of 1-5mum of the plating layers 4 is favorable from the viewpoint of the balance of a function and cost. Gold and/or silver plating is executed to remove the photo-resist layers 3, and the refrigerant flow paths 2, 2a, 2b are shaped through etching by using a corrosive liquid. Etching is performed down to a desired depth, and the corrosive liquid is washed away, thus acquiring a cooling substrate.

Inventors

• 👤 Katsumi Suzuki
• 👤 勝美 鈴木
• 👤 Manabu Sato
• 👤 学 佐藤

Bibliographic Details