Resin seal type semiconductor device

Abstract

Abstract PURPOSE:To improve adhesion between a semiconductor element and sealing resin and humidity resistance, reduce the leak current of a semiconductor under the humidity resistance test, and prevent corrosion and disconnection by arranging a protective layer composed of a specified polymide resin on the semiconductor element surface. CONSTITUTION:On a semiconductor element surface of a resin seal type semiconductor device wherein the semiconductor element is resin-sealed, a protective layer of polyimide resin is formed, which is expressed by the formula, and whose constituent element mol ratio of (A) to (E) are (A)/(B)=99/1-30/70, (C)/(D)=99/1-50/50, [(C)+(D)]/(E)=99/1-70/30. Resin sealing is performed via the above protective layer. By using such polyimide resin, the adhesion between the semiconductor element surface and the polyimide resin is improved; the absorption of moisture from the element periphery is avoided; the humidity resistance is improved; the reliability during manufacturing process is also improved.

Inventors

• 👤 Teru Okunoyama
• 👤 奥野山　輝
• 👤 Tatsuya Onishi
• 👤 龍也 大西

Bibliographic Details