Cooling structure of integrated circuit

Abstract

Abstract PURPOSE:To allow a thermal resistance between integrated circuit elements and a refrigerant to be kept to a low level and discharge heat efficiently outside of mechanical parts after decreasing the flow rate of the refrigerant by introducing the heat produced into fan-shaped fins which are mounted on a cooling plate and expanding areas which come into contact with the refrigerant, thereby improving continuity of the flow of the refrigerant. CONSTITUTION:A cooling plate 6 having respective counter boring holes 5 on the face that is in the reverse direction to integrated circuit elements 2 is mounted through thermal conductivity compounds 4 and fan-shaped fins 8 are formed on the bases of respective counter boring holes 5. On the upper side of the cooling plate 6, intakes 10 which supply the refrigerant 9 for respective counter boring holed 5 come closely into contact with a refrigerant inductor 12 having a flowing path 11 that introduces the refrigerant into each intake of the next counter boring hole 5 and makes the flow of the retrigerant 9 continuous. The refrigerant 9 flows from each intake 10 to each nozzle 13 and its nozzle makes the refrigerant spouts to cool the base of each counter boring hole after colliding with the base of its hole 5. Further, the refrigerant which enters into the flowing path 11 flows into the intake 10 of the next counter boring hole 5 and again spouts from the next nozzle 13. The heat produced is thus discharged by causing this cooling structure to transmit heat efficiently to liquid flowing in the vicinity of the integrated circuit elements.

Inventors

• 👤 Kazuhiko Umezawa
• 👤 梅澤　和彦
• 👤 Jun Kubokawa
• 👤 久保川　潤

Bibliographic Details