Surface treatment for resin film and the like

Abstract

Abstract PURPOSE:To improve the adhesive strength of a thin metallic film by previously applying sand blasting treatment to the surface of a member made of synthetic resin or metal to roughen the surface and then carrying out electric discharge treatment at the time of forming a thin metallic film on the surface of the above member. CONSTITUTION:At the time of forming a thin film of a metal, such as Al, Cu, Cr, Ni, and Sn, or a compound, such as ITO, on the surface of a synthetic resin member or a metallic member by a vacuum vapor deposition method, a sputtering method, an ion plating method, etc., the surface of the synthetic resin member or the metallic member is roughened by means of sand blasting treatment. Subsequently, after this material 6 is placed in a hermetically sealed-type reaction vessel 1 and the inside of this vessel 1 is evacuated by means of a vacuum pump 2, Fe-or Si-type chemicals in a vessel 4 is introduced via a needle valve 3 and, successively, an F-or Si-type thin releasing film is formed by the polymerization by plasma discharge by means of a high-frequency electric power source 5, and further, the surface of the releasing thin film is modified by means of plasma treatment. When a thin film layer of metal, etc., is formed on the surface after the above treatment, the adhesive strength of the thin film layer of metal, etc., to a member made of synthetic resin or metal is improved and the peeling of this thin film layer can be prevented.

Inventors

• 👤 Yasuo Takenoiri
• 👤 竹野入　康夫
• 👤 Kazuhiro Yamashita
• 👤 和宏 山下
• 👤 Takao Okuhara
• 👤 隆夫 奥原
• 👤 Yasuo Izumi
• 👤 泉　恭夫
• 👤 Tsukasa Aoki
• 👤 司 青木

Bibliographic Details