Metallized composition for ceramic

Abstract

Abstract PURPOSE:To obtain the title composition having dense metallized layer suitable in low dielectrics and low expansion coefficient of crystallized glass ceramic, by blending CuO-Cu consisting of CuO and Cu having specific grain distribution with an inorganic component containing MnO2 and Pt or Au, organic binder and solvent. CONSTITUTION:100 pts.wt. total amount of CuO-Cu consisting of 30-70wt.% CuO and 70-30wt.% Cu containing two or more kind of Cu used together in the range of <=20 pts.wt. Cu having 0.5-20mu particle size and 0.8mu average particle size, <=50 pts.wt. Cu having 3.2mu average particle size and (50 pts. wt. Cu having 15mu average particle size is blended with an inorganic component containing either one or more of <=10 pts.wt. MnO2, <=7 pts.wt. Pt and (5 pts.wt. Au, organic binder (e.g. ethyl cellulose) and solvent (e.g., butyl carbitol).

Inventors

• 👤 Kazuo Kondo
• 👤 和夫 近藤
• 👤 Asao Morikawa
• 👤 森川　朝男

Bibliographic Details