Method of conveyance of assembly parts for semiconductor device

Abstract

Abstract PURPOSE:To securely reduce the number of times of conveyances of assembly parts by simultaneously effecting solder printings for all electrode terminals by conveying the assembly parts by means of a positioning pallet. CONSTITUTION:A frame 21 composed of a plurality of kinds of electrode terminals 23-26 coupled each other by a tie bar 22 is joined with a base plate 5 via an insulating substrate 6. The base 5, insulating substrate 6, and frame 21 positioned and housed in a pallet 27 is printed with a solder 9 simultaneously by a printer 28, and then the insulating substrate 6 and the frame 21 are positioned in order on the base plate 5 within the pallet 27 by a mounting unit 29. After semiconductor elements 6, 7 are positioned on the electrode terminals 23-26 of the frame 21, the pallet 27 is forced to pass through a reflow 30, and a flux flowing out from the solder 9 is washed away by a cleaning unit 31. Thereafter, the tie bars 22 are cut away from the frame 21 by a tie bar cutting unit 32. Thereupon, each assembly parts are conveyed by the same pallet 27 among respective processes.

Inventors

• 👤 Hiroshi Watanabe
• 👤 宏 渡辺
• 👤 Kunitaka Kamishima
• 👤 神島　国隆

Bibliographic Details