Manufacture of electrode substrate for liquid crystal display panel

Abstract

Abstract PURPOSE:To generate no pin hole on various thin films to be formed, and also, to prevent an etchant from exerting an undesirable influence on other part even if etching is executed onto a metallic film pad by bringing a first insulating film to etching by a lift-off method and forming the metallic film pad on this etching part. CONSTITUTION:The first process for forming a conductive film 2 to a pattern, a second process for applying a resist onto the conductive film, executing the patterning and allowing the resist to remain behind in a specific position, and a third process for forming a first insulating film 3 on the resist in the specific position, and thereafter, peeling off the resist and exposing the conductive film 2 in the specific position are provided. Also, the title method consists of a fourth process for forming a metallic film pad 4 for covering the exposed conductive film 2 to a pattern, a fifth process for forming the second insulating film 5 on the metallic film pad 4 and the first insulating film 3, and thereafter, bringing a contact hole to pattern formation on the second insulating film 5 of the metallic film pad 4, and a sixth process for connecting a wiring use metal 9 to the metallic film pad 4 exposed from the contact hole. In such a way, even if plural substances whose etching rates are difference are laminated, each patterning can be realized simply and with high accuracy.

Inventors

• 👤 Shoichiro Nakayama
• 👤 中山　正一郎

Bibliographic Details