JP3481812B2
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device or semiconductor wafer having slit in wiring layer and method of manufacturing the same
Assignee: Renesas Technology Corp
•
Filing: 1997-02-14
•
Granted: 2003-12-22
•
Expires: 2017-02-14
Abstract
No abstract record available.
Inventors
- 👤 保 三宅
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-01 09:46
CPC Classifications
—
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.