Bonding pad for integrated circuit and method of manufacturing the same

Abstract

Abstract Translated from Japanese (57)【要約】 【課題】 チップ分類及びワイヤボンディング時に配線 間絶縁膜内の亀裂を最小化しつつ十分な量の電流をチッ プ内に供給でき、写真食刻工程時に回折される光の量を 低減できるほか、検査プローブによる反復的な接触によ り上部配線が上部導電性プラグから剥がれる現象を低減 でき、集積回路の信頼性を向上させることができる集積 回路のためのボンディングパッド構造を提供すること。 【解決手段】 所定距離離隔された第１導電膜及び第２ 導電膜、前記所定距離離隔された第１導電膜及び第２導 電膜間に存在し、前記所定距離離隔された第１導電膜及 び第２導電膜に電気的に接続された連続的な第３導電 膜、及び前記連続的な第３導電膜内に存在し、前記連続 的な第３導電膜を貫通するように延びてその側壁が前記 連続的な第３導電膜により覆われた非整列で、かつ所定 距離離隔された島状絶縁体の配列とを含む。 PROBLEM TO BE SOLVED: To supply a sufficient amount of current into a chip while minimizing cracks in an inter-wiring insulating film at the time of chip classification and wire bonding, and to reduce the amount of light diffracted during a photolithography process. An object of the present invention is to provide a bonding pad structure for an integrated circuit that can reduce the phenomenon that an upper wiring is peeled off from an upper conductive plug due to repeated contact with a test probe and can improve reliability of the integrated circuit. A first conductive film and a second conductive film separated by a predetermined distance are provided. A continuous third conductive film that is present between the first conductive film and the second conductive film separated by the predetermined distance and electrically connected to the first conductive film and the second conductive film separated by the predetermined distance; A non-aligned film that is present in the conductive film and in the continuous third conductive film, extends so as to penetrate the continuous third conductive film, and has a side wall covered by the continuous third conductive film. And an array of island-shaped insulators separated by a predetermined distance.

Inventors

• 👤 Soo-Cheol Lee
• 👤 受 哲 李
• 👤 Shogen An
• 👤 鐘 現 安
• 👤 Keiboku Son
• 👤 京 睦 孫
• 👤 Moo-Jin Jung
• 👤 武 鎮 丁
• 👤 Son-Jong Wang
• 👤 善 鐘 王
• 👤 Jae-Cheol Yoo
• 👤 在 哲 柳
• 👤 Heon-Jong Shin
• 👤 憲 宗 申
• 👤 Keirei Ri
• 👤 恵 令 李
• 👤 Young-Pill Kim
• 👤 栄 泌 金

Bibliographic Details