Semiconductor device and method of manufacturing semiconductor device

Abstract

Abstract PROBLEM TO BE SOLVED: To prevent peeling of resin and semiconductor by forming electrode pads on a semiconductor substrate, forming protruding electrodes on sealing resin sealing the semiconductor substrate, and connecting electrically the electrode pads with the protruding electrodes. SOLUTION: The thickness of a semiconductor substrate 1 is made a specified value in the central part 11, and the thickness of the semiconductor substrate 1 in the peripheral part 12 of a semiconductor element is made thinner than that in the central part 11 to form the peripheral part 6. A wiring 3 of Cu is formed on the semiconductor substrate 1 and electrically connected with aluminum electrode pads 2. The surface of the semiconductor substrate 1 and the wiring 3 are sealed with resin 4. Protruding electrodes 5 as bumps formed of solder or the like are formed on the sealed resin 4 and electrically connected with the aluminum electrode pads 2. Thereby trouble of peeling of the resin 4 and the semiconductor substrate 1 is excluded, and cracks of the surface of the semiconductor element are reduced.

Inventors

• 👤 Akio Nakamura
• 👤 彰男 中村

Bibliographic Details