Wafer cake device

Abstract

Abstract 246,438. Soc. Anon. des Anciens Etablissements J. Manil. Jan. 24, 1925, [Convention date]. Void [Published under Sect. 91 of the Acts]. Wire resistances mounted on flat surfaces.- A device for making wafer biscuits comprises two members 1, 2 hinged together at 3, the member 1 being secured to feet 5 and the member 2 being provided with a handle 6. The device is heated electrically by elements comprising plates 4, 7, made from a mixture of cement and asbestos, and resistance wire wound thereon so that the bulk of the wire is on one side of the plate. The plates are cut with a saw at 8 and the wire is wound as shown in Fig. 3. A single large section wire or a number of small section wires in parallel may be used.

Inventors

No inventors recorded.

Bibliographic Details