GB2277832A
Expired / Lapsed
GB
⏱️ 0.0 years remaining
Thin film multi-layer interconnect
Assignee: BAE Systems PLC
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Filing: 1993-04-27
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Granted: —
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Expires: 2013-04-27
Abstract
Abstract A thin film multi-layer interconnect (7) is made by forming around an elongated electrically conductive member (11) which extends in an interconnect made up of a plurality of layers of insulating material (9, 10 and 12), an electrically conductive shield which encases at least substantially along its length the member (11) and surrounding insulating material (10 and 12). The shield is preferably made up by forming channels on either side of the member 11 and depositing an electrically conductive material layer (14) on the side walls, top and base of the channels into contact with an underlying electrically conductive shielding member (8). <IMAGE>
Inventors
- 👤 Ian Michael Sturland
- 👤 Alan Peter Pritchard
Bibliographic Details
Application Number
—
Jurisdiction
GB
Data Source
google_patents
Last Synchronized
2026-11-09 17:59
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/0219; H05K1/0221; H05K9/00; H05K9/0007; H05K9/002; H05K9/0039; H10; H10W; H10W42/00; H10W42/20; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09818; H05K2201/09981; H05K3/00; H05K3/46; H05K3/4644; H05K3/467
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
203 words
A process for manufacturing a thin film multi-layer interconnect, including the steps of applying at least one elongated strip-like first electrically conductive shielding member to an electrically insulating base layer, applying at least one first electrically insulating layer to the base layer and first shielding member, applying at least one elongated electrically conductive member to said first insulating layer to extend at a spacing from said first shielding member, applying at least a second electrically insulating layer to said electrically conductive member and first insulating layer, forming at least two channels through said second and first insulating layers, one on each side of the.electrically conductive member, to a depth sufficient to expose part of said first shielding member, and applying an electrically conductive shielding coating to the channelled region of the interconnect to cover the side wells of said channels, the basis of said channels into contact with the exposed parts of the first shielding member and over the surface of said second insulating layer extending between the two channels, thereby to encase, with said first shielding member and shielding coating, said at least one electrically conductive member and surrounding electrically insulating layer material along substantially the length of the electrically conductive member.
Claim 2
Dependent Claim
203 words
A process for manufacturing a thin film multi-layer interconnect, including the steps of applying at least one elongated strip-like first electrically conductive shielding member to an electrically insulating base layer, applying at least one first electrically insulating layer to the base layer and first shielding member, applying at least one elongated electrically conductive member to said first insulating layer to extend at a spacing from said first shielding member, applying at least a second electrically insulating layer to said electrically conductive member and first insulating layer, forming at least two channels through said second and first insulating layers, one on each side of the.electrically conductive member, to a depth sufficient to expose part of said first shielding member, and applying an electrically conductive shielding coating to the channelled region of the interconnect to cover the side wells of said channels, the basis of said channels into contact with the exposed parts of the first shielding member and over the surface of said second insulating layer extending between the two channels, thereby to encase, with said first shielding member and shielding coating, said at least one electrically conductive member and surrounding electrically insulating layer material along substantially the length of the electrically conductive member.
Claim 3
Dependent Claim
26 words
A process according to claim 1, in which the base layer and first and second insulating layers utilised are made of a low loss dielectric material.
Claim 4
Dependent Claim
26 words
A process according to claim 1 or claim 2, in which the shielding member, electrically conductive member and shielding coating utilised are made of metallic material.
Claim 5
Dependent Claim
14 words
A process according to claim 3, in which the metallic material utilised is copper.
Claim 6
Dependent Claim
49 words
A process according to any one of claims 1 to 4, in which outlines of said channels are defined photolithographically or by laser ablation and in which the insulating layer material is removed from within said outlines to provide said channels, by wet chemical etching or by plasma processing.
Claim 7
Dependent Claim
33 words
A process according to any one of claims 1 to 5, in which said shielding coating is of metallic material which is applied by physical vapour deposition, chemical vapour deposition or electro chemically.
Claim 8
Dependent Claim
25 words
A processing for manufacturing a thin film, multi-layer interconnect, substantially as hereinbefore described and as illustrated in Figures 2 to 4 of the accompanying drawings.
Claim 9
Dependent Claim
25 words
A processing for manufacturing a thin film, multi-layer interconnect, substantially as hereinbefore described and as illustrated in Figures 2 to 4 of the accompanying drawings.
Claim 10
Dependent Claim
45 words
A thin film, multi-layer interconnect, having at least one elongated electrically conductive member embedded in electrically insulating material, with said insulating material and conductive member being encased at least substantially along its length, by an electrically conductive shield at-least partially embedded in electrically insulating material.
Claim 11
Dependent Claim
45 words
A thin film, multi-layer interconnect, having at least one elongated electrically conductive member embedded in electrically insulating material, with said insulating material and conductive member being encased at least substantially along its length, by an electrically conductive shield at-least partially embedded in electrically insulating material.
Claim 12
Dependent Claim
18 words
An interconnect according to claim 8, wherein the electrically conductive member and shield are made of metallic material.
Claim 13
Dependent Claim
12 words
An interconnect according to claim 9, wherein the metallic material is copper.
Claim 14
Dependent Claim
24 words
An interconnect according to any one of claims 8 to 10, wherein the insulating material is a polyimide or a polytetrafluoroethylene and glass composite.
Claim 15
Dependent Claim
28 words
A thin film, multi-layer interconnect, substantially as hereinbefore described and as illustrated in Figure 4, as modified or not by Figures 2 or 3 of the accompanying drawings.
Claim 16
Dependent Claim
28 words
A thin film, multi-layer interconnect, substantially as hereinbefore described and as illustrated in Figure 4, as modified or not by Figures 2 or 3 of the accompanying drawings.
References Cited (Backward Citations)
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