GB2139248A
Expired / Lapsed
GB
⏱️ 0.0 years remaining
Copper alloy solderable contact pad produced by vapour deposition
Assignee: The General Electric Company PLC
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Filing: 1983-05-04
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Granted: —
•
Expires: 2003-05-04
Abstract
Abstract The pads are formed by a vacuum evaporation technique applied to a starting material that is an alloy of cooper with from above 0.2 to 1.0 wt% aluminium - the thus-formed layer of alloy constituting the desired contact pad -, or alternatively separate billets of aluminium and copper may be simultaneously evaporated. The pads are solderable even when ovened in air at 200 DEG C.
Inventors
- 👤 Brian William Ely
Bibliographic Details
Application Number
—
Jurisdiction
GB
Data Source
google_patents
Last Synchronized
2026-11-04 19:19
CPC Classifications
C; C03; C03C; C03C27/00; C03C27/04; C03C27/042; C03C27/046; B; B23; B23K; B23K35/00; B23K35/001; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/18; H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K2201/00; H05K2201/03; H05K2201/032; H05K2201/0326
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
41 words
A method of constructing solderable contact pads upon a chosen substrate, in which method there is formed on the relavant area of the substrate an aluminium/copper alloy layer as defined hereinbefore, the thus-formed layer of alloy constituting the desired contact pad.
Claim 2
Independent Claim
41 words
A method of constructing solderable contact pads upon a chosen substrate, in which method there is formed on the relavant area of the substrate an aluminium/copper alloy layer as defined hereinbefore, the thus-formed layer of alloy constituting the desired contact pad.
Claim 3
Dependent Claim
21 words
A method as claimed in claim 1, in which the substrate upon which the contact pads are formed is a glass.
Claim 4
Dependent Claim
19 words
A method as claimed in claim 2, in which the substrate is the glass of a liquid crystal cell.
Claim 5
Independent Claim
32 words
A method as claimed in any of the preceding claims, in which the aluminium/copper alloy layer is prepared upon a base adhesion layer that has previously been formed on the substrate surface.
Claim 6
Dependent Claim
18 words
A method as claimed in claim 4, in which the base adhesion layer is of chromium or nichrome.
Claim 7
Independent Claim
21 words
A method as claimed in any of the preceding claims, in which the aluminium/copper layer is vacuum evaporated/deposited onto the substrate.
Claim 8
Dependent Claim
30 words
A method as claimed in claim 6, in which the source of aluminium and copper is an alloy thereof with an aluminium concentration of from above 0.2 to 1.0 wt%.
Claim 9
Independent Claim
40 words
A method as claimed in any of the preceding claims, in which to form contact pads of any particular shape or size an evaporation or sputtering method is utilized with a mask to prevent alloy being deposited on other areas.
Claim 10
Independent Claim
32 words
A method as claimed in any of the preceding claims, in which the aluminium/copper alloy layer is one made as though using an aluminium/copper alloy containing from 0.5 to 0.7 wt% aluminium.
Claim 11
Independent Claim
15 words
A method as claimed in any of the preceding claims and substantially as described hereinbefore.
Claim 12
Dependent Claim
21 words
A substrate, or a device, whenever bearing contact pads formed by a method as claimed in any of the preceding claims.
References Cited (Backward Citations)
GB476655A
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GB538644A
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