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FR2673040A1 Expired / Lapsed FR ⏱️ 0.0 years remaining

Method of assembling and interconnecting modular electronic cards, cards and set of electronic cards according to this method

Assignee: Thales SA
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Filing: 1991-02-19
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Granted: —
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Expires: 2011-02-19
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Abstract

Abstract Translated from French L'invention concerne la confection de cartes électroniques à circuits intégrés hybrides avec plots d'interconnexion, où les plots mâles 5 et femelles 3 sont rapportés directement par brasure 8 sur les faces externes des substrats 2 à circuits intégrés. Par un choix judicieux des emplacements des plots 3 et 5, an peut faire en sorte que tous les plots coopèrent avec des plots d'une carte voisine en libérant ainsi un espace maximum pour la réception des composants électroniques 10. The invention relates to the production of electronic cards with hybrid integrated circuits with interconnection pads, where the male 5 and female pads 3 are attached directly by soldering 8 to the external faces of the substrates 2 with integrated circuits. By a judicious choice of the locations of the pads 3 and 5, an can ensure that all the pads cooperate with the pads of a neighboring card, thus freeing up a maximum space for the reception of the electronic components 10.

Inventors

  • 👤 Mur Remy

Bibliographic Details

Application Number —
Jurisdiction FR
Data Source google_patents
Last Synchronized 2026-11-05 21:37
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H05; H05K; H05K3/00; H05K3/36; H05K3/368; H10W70/00; H10W70/60; H10W70/611; H10W90/401; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/1031; H05K2201/10318; H05K2201/10333; H05K2201/10613; H05K2201/10954; H05K2201/10962; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W90/751; H10W90/754

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

EP0162474A2 Cited
FR2640824A1 Cited
EP0400539A2 Cited

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