Device for vacuum depositing coating e.g. of aluminium on transistors - comprises enclosure partitioned into two compartments communicating via butterfly valve

Abstract

Abstract The vacuum deposition of thin coatings on substrates is performed in an appts comprising a work volume contg the substrate support as well as one or more particle ejectors. The support and the ejectors are disposed in two distinct compartments sepd by a partition which has openings opposite to the ejectors, the openings being adapted for closure by one of several rotating butterfly sectors of a butterfly valve. The ejectors and the openings in the partition are located so that when the valve is open the colour sectors of the butterfly are located against the complete parts of the partition. The appts. can be used to deposit aluminium on transistors and intergrated circuits, complex alloys for the same applications, glass on transistors and integrated circuits as an insulant, complex coatings for mfr of solar or polar sensitive cells, optical coatings and hard surface coatings for spectacles. The appts is of simple construction and is inexpensive to operate.

Inventors

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