Multiple daylight pressing of resin impregnated mats - using stacks of both dry and preimpregnated glass mats

Abstract

Abstract Composite mouldings for printed circuit boards, are mfd. by stacking dry glass mat (1) next to layers of heavily resin impregnated mat (2) and compression moulding to impregnate and bond the dry sheets by partial resin transfer from the other sheets. Multiple moulding by hot compression of several sets of mats in parallel in a multi-daylight tool. The moulding may be made from mixed stock sheets stacked between facing sheets of a different nature, esp. of copper or other metal. Combination of dry and loaded sheets produces a lower, cheaper, overall resin content than use of preimpregnated sheets only. Resin flow during consolidation is pref. coaxial into the interstices of the dry mat, radially as lateral flash to waste.

Inventors

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Bibliographic Details