EP1363319A2
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EP
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Method of transferring a laminate and method of manufacturing a semiconductor device
Assignee: Semiconductor Energy Laboratory Co Ltd
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Filing: 2003-05-09
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Granted: —
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Expires: 2023-05-09
Abstract
Abstract An object of the present invention is to provide a method of transferring an object to be peeled onto a transferring member in a short time without imparting damage to the object to be peeled within a laminate. Also, another object of the present invention is to provide a method of manufacturing a semiconductor device in which a semiconductor element manufactured on a substrate is transferred onto a transferring member, typically, a plastic substrate. The methods are characterized by including: forming a peeling layer (11) and an object (13) to be peeled on a substrate (10); bonding the object to be peeled and a support through a two-sided tape; peeling the object to be peeled from the peeling layer by using a physical method, and then bonding the object to be peeled onto a transferring member; and peeling the support and the two-sided tape from the object to be peeled. <IMAGE>
Inventors
- 👤 Toru Takayama
- 👤 Yuugo Goto
- 👤 Junya Maruyama
- 👤 Yumiko Ohno
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 20:29
CPC Classifications
H; H10; H10D; H10D86/00; H10D86/01; H10D86/021; H10D86/0214; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; H10W; H10W10/00; H10W10/10; H10W10/181; H10P72/00; H10P72/70; H10P72/74; H10P72/7434; Y; Y10; Y10T; Y10T428/00; Y10T428/14
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
72 words
A method of transferring a laminate comprising: forming an object to be peeled over a first substrate through a
peeling layer; bonding a support to the object to be peeled through a peelable
adhesive medium; peeling the peeling layer and the object to be peeled, and bonding
the object to be peeled to a first transferring member; and peeling the support and the peelable adhesive medium from the
object to be peeled.
Claim 2
Independent Claim
90 words
A method of transferring a laminate comprising: forming an object to be peeled over a first substrate through a
peeling layer; bonding a support to the object to be peeled through a peelable
adhesive medium; peeling the peeling layer and the object to be peeled, and bonding
one side of the object to be peeled to a first transferring member; and. peeling the support and the peelable adhesive medium from the
object to be peeled, and bonding another side of the object to be peeled to a second
transferring member.
Claim 3
Independent Claim
75 words
A method of transferring a laminate comprising: forming an object to be peeled over a first substrate through a
peeling layer; bonding a support to the object to be peeled through a peelable
adhesive medium; peeling the peeling layer and the object to be peeled by physical
means, and bonding the object to be peeled to a first transferring member; and peeling the support and the peelable adhesive medium from the
object to be peeled.
Claim 4
Independent Claim
94 words
A method of transferring a laminate comprising: forming an object to be peeled on a first substrate through a
peeling layer; bonding a support to the object to be peeled through a peelable
adhesive medium; peeling the peeling layer and the object to be peeled by physical
means, and bonding one side of the object to be peeled to a first transferring
member; and peeling the support and the peelable adhesive medium from the
object to be peeled, and bonding the other side of the object to be peeled to a
second transferring member.
Claim 5
Independent Claim
52 words
A method of transferring a laminate according to any one of claims 1 to
4, wherein the object to be peeled has a semiconductor element comprising at least
one selected from a thin film transistor, an organic thin film transistor, a thin film
diode, a photoelectric conversion element, and a resistive element.
Claim 6
Independent Claim
48 words
A method of transferring a laminate according to any one of claims 1 to
4, wherein the object to be peeled has an oxide layer comprising at least one
selected from silicon oxide or metal oxide, and the oxide layer is in contact with
contacting the peeling layer.
Claim 7
Independent Claim
47 words
A method of transferring a laminate according to any one of claims 1 to
4, wherein the peeling layer comprises a metal film containing at least one element
selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper,
chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium,
osmium, and iridium.
Claim 8
Independent Claim
47 words
A method of transferring a laminate according to any one of claims 1 to
4, wherein the peeling layer comprises a nitride film containing at least one element
selected from titanium, aluminum, tantalum, tungsten, molybdenum, copper,
chromium, neodymium, iron, nickel, cobalt, ruthenium, rhodium, palladium,
osmium, and iridium.
Claim 9
Independent Claim
31 words
A method of transferring a laminate according to any one of claims 1 to
4, wherein an adhesive of the peelable adhesive medium comprises an adhesive that
is peeled by heat.
Claim 10
Independent Claim
32 words
A method of transferring a laminate according to any one of claims 1 to
4, wherein an adhesive of the peelable adhesive medium comprises an adhesive that
is peeled by ultraviolet light.
Claim 11
Independent Claim
48 words
A method of transferring a laminate according to any one of claims 1 to
4, wherein one adhesive of the peelable adhesive medium comprises an adhesive
that is peeled by heat, and another adhesive of the peelable adhesive medium
comprises an adhesive that is peeled by ultraviolet light.
Claim 12
Independent Claim
23 words
A method of transferring a laminate according to any one of claims 1 to
4, wherein the first transferring member comprises a plastic.
Claim 13
Independent Claim
23 words
A method of transferring a laminate according to any one of claims 2
and 4, wherein the second transferring member comprises a plastic.
Claim 14
Independent Claim
24 words
A method of transferring a laminate according to any one of claims 1 to
4, wherein the peelable adhesive medium comprises a two-sided tape.
Claim 15
Independent Claim
77 words
A method of manufacturing a semiconductor device comprising: forming an object to be peeled comprising a semiconductor
element over a first substrate through a peeling layer; bonding a support to the object to be peeled through a peelable
adhesive medium; peeling the peeling layer and the object to be peeled, and bonding
the object to be peeled to a first transferring member; and peeling the support and the peelable adhesive medium from the
object to be peeled.
Claim 16
Independent Claim
96 words
A method of manufacturing a semiconductor device comprising: forming an object to be peeled comprising a semiconductor
element, on a first substrate through a peeling layer; bonding a support to the object to be peeled through a peelable
adhesive medium; peeling the peeling layer and the object to be peeled, and bonding
one side of the object to be peeled to a first transferring member; and peeling the support and the peelable adhesive medium from the
object to be peeled, and bonding the other side of the object to be peeled to a
second transferring member.
Claim 17
Independent Claim
80 words
A method of manufacturing a semiconductor device comprising: forming an object to be peeled comprising a semiconductor
element, on a first substrate through a peeling layer; bonding a support to the object to be peeled through a peelable
adhesive medium; peeling the peeling layer and the object to be peeled by physical
means, and bonding the object to be peeled to a first transferring member; and peeling the support and the peelable adhesive medium from the
object to be peeled.
Claim 18
Independent Claim
99 words
A method of manufacturing a semiconductor device comprising: forming an object to be peeled comprising a semiconductor
element, on a first substrate through a peeling layer; bonding a support to the object to be peeled through a peelable
adhesive medium; peeling the peeling layer and the object to be peeled by physical
means, and bonding one side of the object to be peeled to a first transferring
member; and peeling the support and the peelable adhesive medium from the
object to be peeled, and bonding the other side of the object to be peeled to a
second transferring member.
Claim 19
Independent Claim
53 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein the object to be peeled has a semiconductor
element comprising at least one selected from a thin film transistor, an organic thin
film transistor, a thin film diode, a photoelectric conversion element, and a resistive
element.
Claim 20
Independent Claim
49 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein the object to be peeled has an oxide layer
comprising at least one selected from silicon oxide or metal oxide, and the oxide
layer is in contact with contacting the peeling layer.
Claim 21
Independent Claim
48 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein the peeling layer comprises a metal film containing
at least one element selected from titanium, aluminum, tantalum, tungsten,
molybdenum, copper, chromium, neodymium, iron, nickel, cobalt, ruthenium,
rhodium, palladium, osmium, and iridium.
Claim 22
Independent Claim
48 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein the peeling layer comprises a nitride film
containing at least one element selected from titanium, aluminum, tantalum,
tungsten, molybdenum, copper, chromium, neodymium, iron, nickel, cobalt,
ruthenium, rhodium, palladium, osmium, and iridium.
Claim 23
Independent Claim
32 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein an adhesive of the peelable adhesive medium
comprises an adhesive that is peeled by heat.
Claim 24
Independent Claim
33 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein an adhesive of the peelable adhesive medium
comprises an adhesive that is peeled by ultraviolet light.
Claim 25
Independent Claim
49 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein one adhesive of the peelable adhesive medium
comprises an adhesive that is peeled by heat, and another adhesive of the peelable
adhesive medium comprises an adhesive that is peeled by ultraviolet light.
Claim 26
Independent Claim
24 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein the first transferring member comprises a plastic.
Claim 27
Independent Claim
24 words
A method of manufacturing a semiconductor device according to any
one of claims 16 and 18, wherein the second transferring member comprises a
plastic.
Claim 28
Independent Claim
25 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein the peelable adhesive medium comprises a
two-sided tape.
Claim 29
Independent Claim
58 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein the semiconductor device is at least one selected
from the group consisting of a personal computer, a video camera, a mobile
computer, a goggle-type display, a player using a recording medium, a digital
camera, a mobile telephone, and an electronic book.
Claim 30
Independent Claim
25 words
A method of manufacturing a semiconductor device according to any
one of claims 15 to 18, wherein the peelable adhesive medium comprises a
two-sided tape.
References Cited (Backward Citations)
No citation records indexed.
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