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EP1176664A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Chip antenna and manufacturing method of the same

Assignee: Furukawa Electric Co Ltd
•
Filing: 2001-07-23
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Granted: —
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Expires: 2021-07-23
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Abstract

Abstract A chip antenna comprises an antenna conductor (10), and a dielectric chip (12) which stacks on a portion of the antenna conductor, in which a conductor exposed portion of the antenna conductor which is not overlapped on the dielectric chip is bent along the surface of the dielectric chip.

Inventors

  • 👤 Isao Tomomatsu
  • 👤 Masayuki Ishiwa
  • 👤 Takahiro Ueno
  • 👤 Toshiyuki Imagawa
  • 👤 Minoru Oozeki

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-07 16:23
CPC Classifications
H; H01; H01Q; H01Q1/00; H01Q1/36; H01Q1/362

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 50 words
A chip antenna characterized by comprising: an antenna conductor (10); and a dielectric chip (12) which stacks on a portion of said antenna conductor, wherein a conductor exposed portion of said antenna conductor which is not overlapped on the dielectric chip is bent along the surface of the dielectric chip.
Claim 2
Dependent Claim 22 words
The chip antenna according to claim 1, characterized in that said antenna conductor is a meandered conductor formed in a meandered shape.
Claim 3
Dependent Claim 31 words
The chip antenna according to claim 2, characterized in that said dielectric chip is formed such that said meandered conductor is overlapped to a middle portion of a meander width direction.
Claim 4
Dependent Claim 31 words
The chip antenna according to claim 2, characterized in that said dielectric chip is formed such that said meandered conductor is overlapped to a middle portion of a meander width direction.
Claim 5
Dependent Claim 51 words
The chip antenna according to claim 1, characterized in that said dielectric chip comprises a plurality of dielectric chips arranged apart from one another in a meander width direction of said meandered conductor, said conductor exposed portion of said meandered conductor is bent, and said plurality of dielectric chips are stacked.
Claim 6
Dependent Claim 51 words
The chip antenna according to claim 1, characterized in that said dielectric chip comprises a plurality of dielectric chips arranged apart from one another in a meander pitch direction of said meandered conductor, said conductor exposed portion of said meandered conductor is bent, and said plurality of dielectric chips are stacked.
Claim 7
Dependent Claim 27 words
The chip antenna according to claim 6, further comprising an extension prevention member (28) configured to prevent the meandered conductor from extending in a meander pitch direction.
Claim 8
Dependent Claim 35 words
The chip antenna according to any one of claims 1 to 7, characterized in that a trench in which the bent conductor is to be disposed is formed in the surface of the dielectric chip.
Claim 9
Dependent Claim 28 words
The chip antenna according to any one of claims 1 to 8, characterized in that an overlapped portion of said antenna conductor is buried in said dielectric chip.
Claim 10
Dependent Claim 26 words
The chip antenna according to any one of claims 1 to 8, characterized by further comprising a protection film (24) to cover said conductor exposed portion.
Claim 11
Dependent Claim 34 words
The chip antenna according to claim 10, characterized in that said protection film is formed of a resin material having a viscosity during molding which is lower than the viscosity of said dielectric chip.
Claim 12
Dependent Claim 49 words
A manufacturing method of a chip antenna characterized by comprising: forming a conductor pattern having a meandered conductor; and forming a dielectric chip so as to overlap at least a portion of said meandered conductor in a meander width direction or a meander pitch direction in the dielectric chip.
Claim 13
Dependent Claim 68 words
The manufacturing method according to claim 12, characterized in that said conductor pattern has a pattern in which the meandered conductor and a frame to surround the meandered conductor are integrally formed, and after forming the dielectric chip, the meandered conductor is separated from the frame and a portion excluding a portion which is buried in the dielectric chip is bent along a surface of the dielectric chip.

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