Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
193 words
A method of manufacturing a wafer package comprising: providing a first wafer (12), a second wafer (24), and a micro device (14); forming a bonding pad (16) and a peripheral pad (20) on said first wafer (12), said
peripheral pad (20) encompassing said bonding pad (16); forming on said second wafer (24) a first seal (34) substantially matching the
perimeter of said bonding pad (16) and a second seal (22) encompassing said
first seal (34) and matching said peripheral pad (20); forming a well (56) in said second wafer (24); bonding said first and said second wafers (12, 24) together using said first and said
second seals (34, 22) and said bonding and peripheral pads (16, 20) to form a
hermetically sealed volume (25) therebetween, said second wafer (24)
positionable with said well (56) over said bonding pad (16), and said micro
device (14) in said hermetically sealed volume (25) between said seals (34,
22); and removing a portion of said second wafer (24) whereby said well (56) becomes a
through hole (26) in said second wafer (24), said through hole (26) open to
said bonding pad (16) on said first wafer (12).
Claim 2
Dependent Claim
77 words
The method of manufacturing a wafer package as claimed in claim 1 wherein
forming said first and said second seals (34, 22) includes: forming a seed layer (48) on said second wafer (24); processing said seed layer (48) to leave a seal-patterned photoresist (50) thereon; depositing said seals (34, 22) on said seed layer (48) using said seal-patterned
photoresist (50); removing said seal-patterned photoresist (50); and removing said seed layer (48) formerly under said seal-patterned photoresist (50).
Claim 3
Dependent Claim
61 words
The method of manufacturing a wafer package as claimed in claim 1 or 2
wherein forming said well (56) in said second wafer (24) includes: processing said second wafer (24) to leave a well-patterned photoresist (54) thereon; forming a well (56) of a predetermined depth in said second wafer (24) using said
well-patterned photoresist (54); and removing said well-patterned photoresist (54).
Claim 4
Independent Claim
53 words
The method of manufacturing a wafer package as claimed in one of the
preceding claims wherein: bonding is performed at a low temperature under compression whereby said first seal
(34) is cold weld bonded to said bonding pad (16) and said second seal (22) is
cold weld bonded to said peripheral pad (20).
Claim 5
Independent Claim
44 words
The method of manufacturing a wafer package as claimed in one of the
preceding claims including: placing said wafer package (10) in a micro device utilizing system; and connecting said micro device utilizing system and said bonding pad (16) on said first
wafer (12).
Claim 6
Independent Claim
36 words
The method of manufacturing a wafer package as claimed in one of the
preceding claims including: defining a recess (66) in one of said wafers (12, 24) whereby a tall micro device (64)
can be accommodated.
Claim 7
Independent Claim
44 words
The method of manufacturing a wafer package as claimed in one of the
preceding claims wherein: providing said micro device (76, 78) includes processing at least one of said first and
said second wafers (72, 74) to form said micro device (76, 78) therein.
Claim 8
Independent Claim
52 words
The method of manufacturing a wafer package as claimed in one of the
preceding claims wherein: forming said first and said second seals (34, 22) forms said seals (34, 22) using a
material selected from a group consisting of gold, silicon, indium, aluminum,
copper, silver, an alloy thereof, and a compound thereof.