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EP1061577A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

High frequency multi-layered circuit component

Assignee: Murata Manufacturing Co Ltd
•
Filing: 2000-06-08
•
Granted: —
•
Expires: 2020-06-08
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Abstract

Abstract A high frequency multi-layered circuit component (11), comprising a plurality of layers (12-14) laminated to each other; an active element mounted on one of the plurality of layers; at least one passive element formed within the plurality of layers (12-14); a high frequency circuit constituted by at least part of the at least one passive element; a power supply line (15) for supplying direct-current power to the active element disposed along one of the plurality of layers (12-14); high frequency hot-lines included in the high frequency multi-layer circuit component (11) and disposed along one or more of the plurality of layers (12-14) which are different from the one of the plurality of layers (12-14) along which the power supply line (15) is disposed; and a ground layer (16, 17) forming capacitance with the power supply line (15) and disposed between the power supply line (15) and the high frequency hot-lines.

Inventors

  • 👤 Norihiro Murata Manufacturing Co. Ltd. Shimada
  • 👤 Takehito Murata Manufacturing Co. Ltd. Ishii
  • 👤 Yoshihiro Murata Manufac. Co. Ltd. Yoshimoto
  • 👤 Ken Murata Manufacturing Co. Ltd. Tonegawa

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-08 08:51
CPC Classifications
H; H03; H03H; H03H7/00; H03H7/01; H03H7/0115; H10; H10W; H10W44/00; H10W44/20; H10W44/601; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H03H1/00; H03H2001/0021; H03H2001/0085; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/0296; H05K1/0298; H05K1/16; H10W70/62; H10W70/63; H10W70/682; H10W70/685

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 176 words
A high frequency multi-layered circuit component (11; 11a; 31), comprising: a plurality of layers (12, 13, 14) laminated to each other; an active element mounted on one of the plurality of layers (12, 13, 14); at least one passive element formed within the plurality of layers (12, 13, 14); a high frequency circuit constituted by at least part of the at least one passive element; a power supply line (15; 25) disposed along one of the plurality of layers (12, 13, 14) for supplying direct-current power to the active element; high frequency hot-lines (34) included in the multi-layer high frequency circuit component and disposed along one or more of the plurality of layers (12, 13, 14) which are different from the one of the plurality of layers (12, 13, 14) along which the power supply line (15; 25) is disposed; and a first ground layer (16, 17; 38, 39, 40) forming capacitance with the power supply line (15; 25) and disposed for shielding between the power supply line (15; 25) and the high frequency hot-lines (34).
Claim 2
Dependent Claim 45 words
The high frequency multi-layered circuit component (11; 11a; 31) according to claim 1, further comprising a second ground layer (16, 17; 38, 39, 40), wherein said first and second ground layers (16, 17; 38, 39, 40) sandwich said power supply line (15; 25) between them.
Claim 3
Dependent Claim 61 words
The high frequency multi-layered circuit component (11; 11a; 31) according to claim 2, wherein said pair of ground layers (16, 17; 38, 39, 40) are disposed with a space between them such that the power supply line (15; 25) is impedance mismatched relative to the high frequency signals, thereby reducing high frequency signals passing through the power supply line (15; 25).

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