Epitaxial material grown laterally within a trench
Abstract
Abstract An epitaxial material (71, 72, 73...) grown laterally in a trench (60) allows for the fabrication of a trench-based semiconductor material that is substantially low in dislocation density. Initiating the growth from a sidewall (61) of a trench (60) minimizes the density of dislocations (54) present in the lattice growth template, which minimizes the dislocation density in the regrown material. Also, by allowing the regrowth to fill and overflow the trench (60), the low dislocation density material (71, 72, 73...) can cover the entire surface of the substrate (52) upon which the low dislocation density material is grown. Furthermore, with successive iterations of the trench growth procedure, higher quality material can be obtained. Devices that require a stable, high quality epitaxial material can then be fabricated from the low dislocation density material.
Inventors
- 👤 Shih Yuan Wang
- 👤 Yong Chen
- 👤 Scott W. Corzine
- 👤 Changhua Chen
- 👤 R. Scott Kern
- 👤 Richard P. Schneider Jr.
Bibliographic Details
Claims Analysis
Total Claims: 10References Cited (Backward Citations)
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