Patent US4695704A successfully refreshed from Google Patents.
EP0920055A2
Expired / Lapsed
EP
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Cooling device for a heat generating componant on a printed board
Assignee: Robert Bosch GmbH
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Filing: 1998-08-20
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Granted: —
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Expires: 2018-08-20
Abstract
Abstract The arrangement has large areas of metallization (8,9) on both sides of the circuit board (1) connected together by metaled through holes (10). An electrically insulating, heat conducting layer is arranged between the cooling body (4) and the opposite side of the circuit board. A thermally conducting heat sink (3) is soldered onto metallization on the opposite side, at least in the section with through metallised holes. The electrically insulating, thermally conducting film (5) is applied to its side remote from the circuit board
Inventors
- 👤 Heinz Irschik
- 👤 Gerhard Koelle
- 👤 Wolfgang Harrer
- 👤 Albert Geiger
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 17:53
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H10; H10W; H10W40/00; H10W40/10; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H05K2201/00; H05K2201/06; H05K2201/066; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09572; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10969; H05K2203/00; H05K2203/04; H05K2203/0455; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/40; H05K3/42
Claims Analysis
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