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EP0899779A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method for fabricating thermally stable contacts

Assignee: Texas Instruments Inc
•
Filing: 1998-08-28
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Granted: —
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Expires: 2018-08-28
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Abstract

Abstract In order to provide a thermally stable diffusion barrier for a contact, a layer of titanium (11) is formed on the patterned substrate (10). A layer of tungsten nitride (12) is formed on the titanium layer (11). After an annealing step, an interfacial layer (11') and a layer of titanium nitride (12') are formed between the substrate (10) and a tungsten layer (13'). These layers provide a diffusion barrier which is more thermally stable than a titanium nitride layer applied directly on the substrate and which permits the formation of a contact structures that can withstand subsequent high temperature steps.

Inventors

  • 👤 Jiong-Ping Lu
  • 👤 Chih-Chen Cho

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 01:08
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/032; H10W20/047; C; C23; C23C; C23C16/00; C23C16/06; C23C16/08; C23C16/16; H10W20/033; Y; Y10; Y10S; Y10S438/00; Y10S438/927

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 44 words
A method of forming a diffusion barrier layer for a contact structure, said method comprising the steps of: forming a layer of titanium on a patterned substrate; forming a layer of tungsten nitride on said titanium layer; annealing said layers along with said substrate.
Claim 2
Dependent Claim 21 words
The method of claim 1 wherein titanium is replaced by an element selected from the group consisting of cobalt and nickel.
Claim 3
Dependent Claim 36 words
The method of claim 1 wherein said titanium layer is replaced by an MSi x layer or MSi x /M layers, wherein M is a metal selected from the group consisting of titanium, cobalt and nickel.
Claim 4
Dependent Claim 42 words
The method of claim 1 wherein said titanium layer is formed using a CVD process based on the chemical process TiX 4 + H 2 → Ti + HX, where X is selected from the group consisting of chlorine, bromine and iodine.
Claim 5
Dependent Claim 70 words
The method of claim 1 wherein said tungsten nitride layer is formed using CVD process based on a chemical process selected from the group of chemical processes consisting of: WF 6 + NH 3 + H 2 → WN x + HF, WF 6 + N 2 + H 2 → WN x + HF, and W(CO) 6 + NH 3 → WN x + CO + H 2 .
Claim 6
Independent Claim 49 words
A method for forming a contact structure, said method comprising the steps of: forming a titanium layer on a substrate; forming a tungsten nitride layer on said titanium layer; forming a tungsten layer on said tungsten nitride layer; and annealing the structure resulting from a formation of these layers.
Claim 7
Dependent Claim 21 words
The method of claim 8 wherein titanium is replaced by an element selected from the group consisting of cobalt and nickel.
Claim 8
Dependent Claim 38 words
The method of claim 8 wherein said titanium layer is replaced by a one of an MSi x layer or a MSi x /M layers, where M is selected from the group consisting of titanium, cobalt, or nickel.
Claim 9
Dependent Claim 45 words
The method of claim 8 wherein said titanium layer is formed using a CVD process based on the chemical process TiX 4 + H 2 → Ti + HX, wherein X is selected from the group consisting of chorine (Cl), bromine (Br), and iodine (I).
Claim 10
Dependent Claim 69 words
The method of claim 8 wherein said tungsten nitride layer is formed using CVD process based on a chemical process selected from the group of chemical processes consisting of: WF 6 + NH 3 + H 2 → WN x + HF, WF 6 + N 2 + H 2 → WN x +HF, and W(CO) 6 + NH 3 → WN x + CO + H 2 .

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