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EP0858110A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method

Assignee: Seiko Epson Corp
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Filing: 1997-08-26
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Granted: —
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Expires: 2017-08-26
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Abstract

Abstract A method for transferring a thin film device on a substrate onto a transfer member, includes: a step for forming a separation layer on the substrate, a step for forming a transferred layer including the thin film device on the separation layer, a step for adhering the transferred layer including the thin film device to the transfer member with an adhesive layer therebetween, a step for irradiating the separation layer with light so as to form internal and/or interfacial exfoliation of the separation layer, and a step for detaching the substrate from the separation layer. <IMAGE>

Inventors

  • 👤 Tatsuya Seiko Epson Corporation SHIMODA
  • 👤 Satoshi Seiko Epson Corporation INOUE
  • 👤 Wakao Seiko Epson Corporation MIYAZAWA

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-05 09:54
CPC Classifications
H; H10; H10D; H10D86/00; H10D86/01; H10D86/021; H10D86/0214; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1345; G02F1/13454; G02F1/136; G02F1/13613; G02F1/1362; G02F1/1368; H10D86/40; H10D86/60; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7448; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; H10P90/1916; H10P90/1924; H10W; H10W10/00; H10W10/10; H10W10/181; H10D30/00; H10D30/60; H10D30/67; H10D30/6758; H10P72/743; H10P72/7432

Claims Analysis

Total Claims: 77
Claim 1
Independent Claim 53 words
An exfoliating method for exfoliating a detached member, which is present on a substrate with a separation layer therebetween, from said substrate, wherein said separation layer is irradiated with incident light so as to cause exfoliation in said separation layer and/or at the interface, and to detach said detached member from said substrate.
Claim 2
Dependent Claim 62 words
An exfoliating method for exfoliating a detached member, which is present on a transparent substrate with a separation layer therebetween, from said transparent substrate, wherein said separation layer is irradiated with incident light from the side of said transparent substrate so as to cause exfoliation in said separation layer and/or at the interface, and to detach said detached member from said substrate.
Claim 3
Dependent Claim 84 words
An exfoliating method for exfoliating a transferred layer, formed on a substrate with a separation layer therebetween, from said substrate and for transferring said transferred layer onto a transfer member, wherein after said transfer member is adhered to the Opposite side of said transferred layer to said substrate, said separation layer is irradiated with incident light so as to cause exfoliation in said separation layer and/or at the interface, and to detach said transferred layer from said substrate to transfer onto said transfer member.
Claim 4
Dependent Claim 95 words
An exfoliating method for exfoliating a transferred layer, formed on a transparent substrate with a separation layer therebetween, from said transparent substrate and for transferring said transferred layer onto a transfer member, wherein after said transfer member is adhered to the opposite side of said transferred layer to said transparent substrate, said separation layer is irradiated with incident light from the side of said transparent substrate so as to cause exfoliation in said separation layer and/or at the interface, and to detach said transferred layer from said transparent substrate to transfer onto said transfer member.
Claim 5
Dependent Claim 91 words
An exfoliating method comprising the following steps of: forming a separation layer on a transparent substrate, forming a transferred layer on said separation layer directly or with a given interlayer therebetween, adhering said transfer member to the opposite side of said transferred layer to said transparent substrate, and irradiating said separation layer with incident light from the side of said transparent substrate so as to cause exfoliation in said separation layer and/or at the interface, and to detach said transferred layer from said transparent substrate to transfer onto said transfer member.
Claim 6
Dependent Claim 42 words
The exfoliating method according to claim 5, wherein said exfoliating method further comprises a step for removing said separation layer adhered to the side of said transparent substrate and/or transfer member, after the transfer of said transferred layer onto said transfer member.
Claim 7
Dependent Claim 26 words
The exfoliating method according to any one of claims 3 to 6, wherein said transferred layer is a functional thin film or a thin film device.
Claim 8
Dependent Claim 21 words
The exfoliating method according to any one of claims 3 to 6, wherein said transferred layer is a thin film transistor.
Claim 9
Dependent Claim 20 words
The exfoliating method according to any one of claims 3 to 8, wherein said transfer member is a transparent substrate.
Claim 10
Dependent Claim 46 words
The exfoliating method according to any one of claims 3 to 9, wherein when the maximum temperature in the formation of said transferred layer is Tmax, said transfer member comprises a material having a glass transition point (Tg) or softening point which is lower than Tmax.
Claim 11
Dependent Claim 34 words
The exfoliating method according to any one of claims 3 to 10, wherein said transfer member comprises a material having a glass transition point (Tg) or softening point which is lower than 800 °C.
Claim 12
Dependent Claim 22 words
The exfoliating method according to any one of claims 3 to 11, wherein said transfer member comprises a synthetic resin or glass.
Claim 13
Dependent Claim 18 words
The exfoliating method according to any one of claims 1 to 12, wherein said substrate has thermal resistance.
Claim 14
Dependent Claim 40 words
The exfoliating method according to any one of claims 3 to 12, wherein when the maximum temperature in the formation of said transferred layer is Tmax, said substrate comprises a material having a distortion point which is lower than Tmax.
Claim 15
Dependent Claim 44 words
The exfoliating method according to any one of claims 1 to 14, wherein the exfoliation of said separation layer is caused by an elimination of or a decrease in the adhering force between atoms or molecules in the constituent substances in said separation layer.
Claim 16
Dependent Claim 19 words
The exfoliating method according to any one of claims 1 to 15, wherein said incident light is laser light.
Claim 17
Dependent Claim 20 words
The exfoliating method according to claim 16, wherein said laser light has a wavelength of 100 nm to 350 nm.
Claim 18
Dependent Claim 20 words
The exfoliating method according to claim 16, wherein said laser light has a wavelength of 350 nm to 1,200 nm.
Claim 19
Dependent Claim 19 words
The exfoliating method according to any one of claims 1 to 18, wherein said separation layer comprises amorphous silicon.
Claim 20
Dependent Claim 20 words
The exfoliating method according to claim 19, wherein said amorphous silicon contains 2 atomic percent or more of hydrogen (H).
Claim 21
Dependent Claim 19 words
The exfoliating method according to any one of claims 1 to 18, wherein said separation layer comprises a ceramic.
Claim 22
Dependent Claim 19 words
The exfoliating method according to any one of claims 1 to 18, wherein said separation layer comprises a metal.
Claim 23
Dependent Claim 20 words
The exfoliating method according to any one of claims 1 to 18, wherein said separation layer comprises an organic polymer.
Claim 24
Dependent Claim 32 words
The exfoliating method according to claim 23, wherein said organic polymer has at least one adhere selected from the group consisting of -CH 2 -, -CO-, -CONH-, -NH-, -COO-, -N=N-, and -CH=N-.
Claim 25
Dependent Claim 23 words
The exfoliating method according to either claim 23 or 24, wherein said organic polymer has an aromatic hydrocarbon group in the chemical formula.
Claim 26
Dependent Claim 25 words
The exfoliating method according to any one of claims 1 to 25, wherein said separation layer comprises a composite material including a plurality of sub-layers.
Claim 27
Dependent Claim 21 words
The exfoliating method according to claim 26, wherein said separation layer comprises at least two sub-layers having different compositions or characteristics.
Claim 28
Dependent Claim 38 words
The exfoliating method according to either claim 26 or 27, wherein said separation layer comprises an optical absorption layer for absorbing said incident light and another layer having a different composition or property from said optical absorption layer.
Claim 29
Dependent Claim 35 words
The exfoliating method according to any one of claims 26 to 28, wherein said separation layer comprises an optical absorption layer for absorbing said incident light and a shading layer for shading said incident light.
Claim 30
Dependent Claim 30 words
The exfoliating method according to any one of claims 1 to 29, wherein said shading layer lies at the opposite side of said optical absorption layer to said incident light.
Claim 31
Dependent Claim 23 words
The exfoliating method according to either claim 29 or 30, wherein said shading layer is a reflection layer for reflecting said incident light.
Claim 32
Dependent Claim 16 words
The exfoliating method according to claim 31, wherein said reflection layer comprises a metallic thin film.
Claim 33
Dependent Claim 40 words
The exfoliating method according to any one of claims 28 to 32, wherein the exfoliation of said separation layer occurs by elimination or reduction of the adhering force between atoms or molecules in the constituent of said optical absorption layer.
Claim 34
Dependent Claim 24 words
The exfoliating method according to any one of claims 26 to 33, wherein said separation layer comprises an optical absorption layer comprising amorphous silicon.
Claim 35
Dependent Claim 20 words
The exfoliating method according to claim 34, wherein said amorphous silicon contains 2 atomic percent or more of hydrogen (H).
Claim 36
Dependent Claim 19 words
The exfoliating method according to any one of claims 26 to 33, wherein said separation layer comprises a ceramic.
Claim 37
Dependent Claim 19 words
The exfoliating method according to any one of claims 26 to 33, wherein said separation layer comprises a metal.
Claim 38
Dependent Claim 20 words
The exfoliating method according to any one of claims 26 to 33, wherein said separation layer comprises an organic polymer.
Claim 39
Dependent Claim 32 words
The exfoliating method according to claim 38, wherein said organic polymer has at least one adhere selected from the group consisting of -CH 2 -, -CO-, -CONH-, -NH-, -COO-, -N=N-, and -CH=N-.
Claim 40
Independent Claim 84 words
A method for transferring a thin film device on a substrate onto a transfer member comprising the following steps of: forming a separation layer on said substrate; forming a transferred layer including said thin film device onto said separation layer; adhering said transferred layer including said thin film device to said transfer member with an adhesive layer, irradiating said separation layer with light so as to cause exfoliation in said separation layer and/or at the interface; and detaching said substrate from said separation layer.
Claim 41
Independent Claim 171 words
A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising: a first step for forming an amorphous silicon layer on said substrate; a second step for forming said transferred layer including said thin film device on said amorphous silicon layer; a third step for adhering said transferred layer including said thin film device to said transfer member with an adhesive layer; a fourth step for irradiating said amorphous silicon layer with light through said substrate so as to cause exfoliation in said amorphous silicon layer and/or at the interface and to decrease the adhering force between said substrate and said transferred layer; and a fifth step for detaching said substrate from said amorphous silicon layer; wherein said transferred layer formed in said second step comprises a thin film transistor, and the thickness of said amorphous silicon layer formed in said first step is smaller than the thickness of the channel layer of said thin film transistor formed in said second step.
Claim 42
Independent Claim 133 words
A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising: a first step for forming an amorphous silicon layer having a thickness of 25 nm or less on said substrate; a second step for forming said transferred layer including said thin film device on said amorphous silicon layer; a third step for adhering said transferred layer including said thin film device to said transfer member with an adhesive layer; a fourth step for irradiating said amorphous silicon layer with light through said substrate so as to cause exfoliation in said amorphous silicon layer and/or at the interface and to decrease the adhering force between said substrate and said transferred layer; and a fifth step for detaching said substrate from said amorphous silicon layer.
Claim 43
Dependent Claim 35 words
The method for transferring a transferred layer including a thin film device according to claim 42, wherein in said first step, said amorphous silicon layer having a thickness of 11 nm or less is formed.
Claim 44
Independent Claim 40 words
The method for transferring a transferred layer including a thin film device according to any one of claims 41 to 43, wherein in said first step, said amorphous silicon layer is formed by a low pressure chemical vapor deposition process.
Claim 45
Independent Claim 103 words
A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising the following steps of: forming a separation layer onto said substrate; forming a silicon-based optical absorption layer on said separation layer; forming said transferred layer including said thin film device on said silicon-based optical absorption layer; adhering said transferred layer including said thin film device to said transfer member with an adhesive layer; irradiating said separation layer with light through said substrate so as to cause exfoliation in said separation layer and/or at the interface; and detaching said substrate from said separation layer.
Claim 46
Dependent Claim 50 words
A method for transferring a transferred layer including a thin film device according to claim 45, wherein said separation layer and said optical absorption layer comprise amorphous silicon, and said method further comprises a step for providing a silicon-based intervening layer between said separation layer and said optical absorption layer.
Claim 47
Independent Claim 161 words
A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising: a first step for forming a separation layer on said substrate; a second step for forming said transferred layer including said thin film device on said separation layer; a third step for adhering said transferred layer including said thin film device to said transfer member with an adhesive layer; a fourth step for irradiating said separation layer with light through said substrate so as to cause exfoliation in said separation layer and/or at the interface; and a fifth step for detaching said substrate from said separation layer; wherein, in said fourth step, the stress, acting on upper layers above said separation layer in the exfoliation in said separation layer and/or at the interface, is absorbed by the proof stress of said upper layers above said separation layer to prevent the deformation and breakage of said upper layers above said separation layer.
Claim 48
Dependent Claim 49 words
The method for transferring a transferred layer including a thin film device according to claim 47, wherein said method further comprises a step for forming a reinforcing layer for securing said proof stress at any position in said upper layers above said separation layer, prior to said fourth step.
Claim 49
Independent Claim 147 words
A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising: a first step for forming a separation layer on said substrate; a second step for forming said transferred layer including said thin film device on said separation layer; a third step for adhering said transferred layer including said thin film device to said transfer member with an adhesive layer; a fourth step for irradiating said separation layer with light through said substrate so as to cause exfoliation in said separation layer and/or at the interface; and a fifth step for detaching said substrate from said separation layer; wherein said fourth step includes sequential scanning of beams for locally irradiating said separation layer, such that a region irradiated by the N-th beam (wherein N is an integer of 1 or more) does not overlap with other irradiated regions.
Claim 50
Independent Claim 167 words
A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising: a first step for forming a separation layer on said substrate; a second step for forming said transferred layer including said thin film device on said separation layer; a third step for adhering said transferred layer including said thin film device to said transfer member with an adhesive layer; a fourth step for irradiating said separation layer with light through said substrate so as to cause exfoliation in said separation layer and/or at the interface; and a fifth step for detaching said substrate from said separation layer; wherein said fourth step includes sequential scanning of beams for locally irradiating said separation layer, such that each beam has a flat peak region having the maximum optical intensity in the center, and a flat peak region irradiated by the N-th beam (wherein N is an integer of 1 or more) does not overlap with other irradiated flat peak regions.
Claim 51
Independent Claim 178 words
A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising: a first step for forming a separation layer on said substrate; a second step for forming said transferred layer including said thin film device on said separation layer; a third step for adhering said transferred layer including said thin film device to said transfer member with an adhesive layer; a fourth step for irradiating said separation layer with light through said substrate so as to cause exfoliation in said separation layer and/or at the interface; and a fifth step for detaching said substrate from said separation layer; wherein said fourth step includes sequential scanning of beams for locally irradiating said separation layer, such that each beam has the maximum optical intensity in the central region, and an effective region irradiated by the N-th beam (wherein N is an integer of 1 or more) having an intensity, which is 90% or more of the maximum intensity, does not overlap with the other effective regions irradiated by other beam scanning.
Claim 52
Independent Claim 41 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said substrate is a transparent substrate, said separation layer is irradiated with said incident light through said transparent substrate.
Claim 53
Independent Claim 38 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said method further comprises a step for removing said separation layer adhered to said transfer member.
Claim 54
Independent Claim 29 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said transfer member is a transparent substrate.
Claim 55
Independent Claim 55 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein when the maximum temperature of said transfer member during the formation is Tmax, said transfer member comprises a material having a glass transition point (Tg) or softening point which is lower than Tmax.
Claim 56
Independent Claim 49 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein the glass transition point (Tg) or softening point of said transfer member is lower than said maximum temperature in the process for forming said thin film device.
Claim 57
Independent Claim 33 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said transfer member comprises a synthetic resin or a glass material.
Claim 58
Independent Claim 27 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said substrate has heat resistance.
Claim 59
Independent Claim 39 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said substrate has a transmittance of 10% or more for light with a wavelength of 310 nm.
Claim 60
Independent Claim 48 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein when the maximum temperature in the formation of said transferred layer is Tmax, said substrate comprises a material having a distortion point of Tmax or more.
Claim 61
Independent Claim 28 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said separation layer comprises amorphous silicon.
Claim 62
Dependent Claim 29 words
The method for transferring a transferred layer including a thin film device according to claim 61, wherein said amorphous silicon contains 2 atomic percent or more of hydrogen (H).
Claim 63
Dependent Claim 30 words
The method for transferring a transferred layer including a thin film device according to claim 62, wherein said amorphous silicon may contain 10 atomic percent or more of hydrogen (H).
Claim 64
Independent Claim 28 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said separation layer comprises silicon nitride.
Claim 65
Independent Claim 29 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said separation layer comprises a hydrogen-containing alloy.
Claim 66
Independent Claim 29 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said separation layer comprises a nitrogen-containing alloy.
Claim 67
Independent Claim 29 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said separation layer comprises a multi-layered film.
Claim 68
Dependent Claim 31 words
The method for transferring a transferred layer including a thin film device according to claim 67, wherein said multi-layered film comprises an amorphous silicon film and a metallic film formed thereon.
Claim 69
Dependent Claim 36 words
The method for transferring a transferred layer including a thin film device according to claim 40, wherein said separation layer comprises at least one material selected from the group consisting of ceramics, metals, and organic polymers.
Claim 70
Independent Claim 27 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said light is laser light.
Claim 71
Dependent Claim 29 words
The method for transferring a transferred layer including a thin film device according to claim 70, wherein said laser light has a wavelength of 100 nm to 350 nm.
Claim 72
Dependent Claim 30 words
The method for transferring a transferred layer including a thin film device according to claim 70, wherein said laser light may have a wavelength of 350 nm to 1,200 nm.
Claim 73
Independent Claim 31 words
The method for transferring a transferred layer including a thin film device according to any one of claims 40 to 51, wherein said thin film device is a thin film transistor.
Claim 74
Dependent Claim 23 words
The thin film device transferred onto said transfer member by a method for transferring described in any one of claims 40 to 51.
Claim 75
Dependent Claim 18 words
The thin film device according to claim 74, wherein said thin film device is a thin film transistor.
Claim 76
Dependent Claim 30 words
A thin film integrated circuit device comprising a thin film device transferred onto said transfer member by a method for transferring described in any one of claims 40 to 51.
Claim 77
Dependent Claim 56 words
A liquid crystal display device comprising: a matrix of thin film transistors, a pixel section comprising pixel electrodes each connected to one end of each thin film transistor, and an active matrix substrate produced by transferring the thin film transistors in said pixel section by a method described in any one of claims 40 to 51.

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