EP0844665A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Wafer level packaging
Assignee: Texas Instruments Inc
•
Filing: 1997-11-18
•
Granted: —
•
Expires: 2017-11-18
Abstract
Abstract An integrated circuit package (50) may include an integrated circuit chip (22) having an integrated circuit (14). A lead frame (28) may be opposite the integrated circuit chip (22). The lead frame (28) may include at least one lead (30) electrically coupled to the integrated circuit (14) by a connector (42). The lead (30) may be within a periphery (32) of the integrated circuit chip (22). An encapsulant (44) may cover the integrated circuit (14), the connector (42) and a portion of the lead frame (28). A remaining portion of the lead frame (28) may be exposed from the encapsulant (44).
Inventors
- 👤 Walter H. Schroen
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 12:21
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H10W90/811; H10W70/00; H10W70/01; H10W70/04; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/442; H10W70/456; H10W70/457; H10W70/464; H10W72/00; H10W72/50; H10W74/131; H10W74/40; H10W74/47; H10W72/01; H10W72/0198; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
70 words
An integrated circuit package, comprising: an integrated circuit chip including an
integrated circuit; a lead frame including at least one lead
electrically coupled to the integrated circuit by a
connector; the lead being disposed within a periphery
of the integrated circuit; an encapsulant covering the integrated circuit,
the connector, and at least a portion of the lead frame;
and a remaining portion of the lead frame exposed
from the encapsulant.
Claim 2
Dependent Claim
41 words
The integrated circuit package of Claim 1,
further comprising: the lead frame including a plurality of leads;
each lead electrically coupled to the integrated circuit by
a connector; and each lead being disposed within the
periphery of the integrated circuit chip.
Claim 3
Dependent Claim
25 words
The integrated circuit package of Claim 1 or
Claim 2, wherein a distal end of the lead is substantially
parallel to the integrated circuit chip.
Claim 4
Dependent Claim
26 words
The integrated circuit package of any of Claims 1
to 3, wherein the connector is a wire bonded to the lead
and to the integrated circuit.
Claim 5
Dependent Claim
50 words
The integrated circuit package of any of Claims 1
to 4, further comprising: a bonding pad electrically coupled to the
integrated circuit; the bonding pad being disposed proximate to a
centerline of the integrated circuit; and the connector
being a wire bonded to the lead and to the bonding pad.
Claim 6
Dependent Claim
20 words
The integrated circuit package of any of Claims 1
to 5, wherein the or each lead is plated with palladium.
Claim 7
Dependent Claim
75 words
A packaged device, comprising: a device including a plurality of integrated
circuit chips; each integrated circuit chip including an
integrated circuit; a lead frame electrically coupled to an opposing
integrated circuit by a connector; the lead being disposed
within a periphery of an opposing integrated circuit; an encapsulant covering the integrated circuits,
the connectors, and at least a portion of each lead frame;
and a remaining portion of each lead frame exposed
from the encapsulant.
Claim 8
Dependent Claim
18 words
The packaged device of Claim 7, wherein the sheet
of lead frames comprises a unitary sheet of material.
Claim 9
Dependent Claim
46 words
The packaged device of Claim 7 or Claim 8,
wherein the lead frames each further comprise: a plurality of leads; each electrically coupled
to the opposing integrated circuit by a connector; and the leads each being disposed within the
periphery of the opposing integrated circuit chip.
Claim 10
Dependent Claim
28 words
The packaged device of any of Claims 7 to 9,
wherein a distal end of the or each lead is substantially
parallel to the opposing integrated circuit chip.
Claim 11
Dependent Claim
26 words
The packaged device of any of Claims 7 to 10,
wherein each connector is a wire bonded to the lead and to
the opposing integrated circuit.
Claim 12
Dependent Claim
50 words
The packaged device of any of Claims 7 to 11,
further comprising: a bonding pad electrically coupled to each of the
integrated circuits; the bonding pad disposed
proximate to a centerline of the integrated circuit; and
the connector being a wire bonded to the lead and to the
bonding pad.
Claim 13
Dependent Claim
19 words
The packaged device of any of Claims 7 to 12,
wherein the or each lead is plated with palladium.
Claim 14
Independent Claim
81 words
A method of packaging an integrated circuit,
comprising the steps of: disposing a frame opposite a plurality of
integrated circuit chips each including an integrated
circuit, the lead frame including a lead within a periphery
of an opposing integrated circuit chip; electrically coupling the lead of the lead frame
to the opposing integrated circuit chip; and encapsulating the integrated circuits and a
portion of the lead frame, each encapsulated integrated
circuit and opposing lead frame forming a discrete
integrated circuit package.
Claim 15
Dependent Claim
23 words
The method of Claim 14, wherein the step of
disposing the lead frame comprises a lead frame comprising
a unitary sheet of material.
Claim 16
Dependent Claim
41 words
The method of Claim 14 or Claim 15, wherein the
step of electrically coupling the lead to an opposing
integrated circuit comprises the step of bonding a wire to
the lead and to a bonding pad of the opposed integrated
circuit.
Claim 17
Independent Claim
22 words
The method of any of Claims 14 to 16, further
comprising the step of detaching the integrated circuit
packages from one another.
Claim 18
Independent Claim
23 words
The method of any of Claims 14 to 17, further
comprising the step of mounting each lead frame to the
opposing integrated circuit.
Claim 19
Independent Claim
23 words
The method of any of Claims 14 to 18, further
comprising the step of forming a polymide layer on the
integrated circuit chips.
Claim 20
Independent Claim
19 words
The method of any of Claims 14 to 19, further
comprising the step of plating the lead with palladium.
References Cited (Backward Citations)
No citation records indexed.
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