EP0810655A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A package for a semiconductor device
Assignee: Texas Instruments Inc
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Filing: 1997-05-29
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Granted: —
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Expires: 2017-05-29
Abstract
Abstract A package for an integrated circuit includes a circuit board 122 for mounting the integrated circuit 114 having a first surface and a second surface, a connection device positioned on the first surface of the circuit board 122 for electrically connecting the integrated circuit 114 and the integrated circuit 114 being positioned on the second surface of the integrated circuit 114. <IMAGE>
Inventors
- 👤 Jing S. Goh
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 13:31
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/30; H10W72/321; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W74/131; H10W74/142; H10W90/731; H10W90/734; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
45 words
A package for an integrated circuit, comprising: means for mounting the integrated circuit having a first surface and a second surface; a connector device positioned on the first surface for electrically connecting the integrated circuit; and said integrated circuit being positioned on the second surface.
Claim 2
Dependent Claim
22 words
A package for an integrated circuit as in Claim 1, wherein said integrated circuit is attached to said second surface by epoxy.
Claim 3
Dependent Claim
23 words
A package for an integrated circuit as in Claim 1, wherein said integrated circuit is attached to said second surface by adhesive tape.
Claim 4
Dependent Claim
17 words
A package for an integrated circuit as in Claim 3, wherein said adhesive tape is polymide tape.
Claim 5
Dependent Claim
30 words
A package for an integrated circuit as in any preceding Claim, wherein said means comprises a hole therethrough for placing wires to connect the integrated circuit and said connection device.
Claim 6
Dependent Claim
19 words
A package for an integrated circuit as in any preceding Claim, wherein said connection device includes a solder ball.
Claim 7
Dependent Claim
40 words
A package for an integrated circuit as in any preceding Claim, wherein the package further comprises: a sealing material to seal the integrated circuit, and wherein the sealing material forms a flush surface with a surface of the integrated circuit.
Claim 8
Dependent Claim
24 words
A package for an integrated circuit as in any preceding Claim, wherein the package further comprises a sealing material for encapsulating the integrated circuit.
Claim 9
Dependent Claim
23 words
A package for an integrated circuit as in any preceding claim, wherein said means for mounting the integrated circuit is a circuit board.
Claim 10
Independent Claim
57 words
A method of forming a package for an integrated circuit comprising; forming a hole through a circuit board having a first surface and a second surface; placing a connector device on the first surface adjacent said hole for electrically connecting the integrated circuit; placing said integrated circuit on the second surface in the region overlaying said hole.
Claim 11
Dependent Claim
19 words
The method of claim 10, further comprising securing said integrated to said second surtace by means of an adhesive.
Claim 12
Dependent Claim
23 words
The method of Claim 10 or Claim 11 further comprising forming wires from said integrated circuit to said first surface through said hole.
Claim 13
Independent Claim
28 words
The method of any of Claims 10 to 12 further comprising forming a sealing material over said hole and a region of said first surface adjacent said hole.
Claim 14
Independent Claim
19 words
The method of any of Claims 10 to 13 further comprising forming a sealing material over said integrated circuit.
References Cited (Backward Citations)
No citation records indexed.
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