Patent EP0156099A2 successfully refreshed from Google Patents.
EP0789397A2
Expired / Lapsed
EP
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Circuit board and semiconductor device using the circuit board
Assignee: Hitachi Ltd
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Filing: 1997-01-30
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Granted: —
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Expires: 2017-01-30
Abstract
Abstract A semiconductor device comprises a metal base plate, an insulating substrate (1) placed on the metal base plate, a conductive foil (3) bonded to the insulating substrate with a bonding layer (2), and a semiconductor element mounted on the conductive foil. A marginal portion of the bonding layer spreads outside beyond the edges of the conductive foil.
Inventors
- 👤 Akira Tanaka
- 👤 Tadao Kushima
- 👤 Hideo Shimizu
- 👤 Sensuke Okada
- 👤 Yoshihiko Koike
- 👤 Kazuji Yamada
- 👤 Ryuichi Saito
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 13:42
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0271; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/255; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09145; H05K2201/09209; H05K2201/09654; H05K2201/098; H05K3/00; H05K3/0058; H05K3/38; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
37 words
A circuit board comprising: an insulating substrate; and a conductive foil bonded to the insulating substrate with a bonding layer; wherein a marginal portion of the bonding layer spreads outside beyond the edges of the conductive foil.
Claim 2
Dependent Claim
35 words
The circuit board according to claim 1, wherein the marginal portion of the bonding layer spreading outside beyond the edges of the conductive foil has a width greater than the thickness of the bonding layer.
Claim 3
Dependent Claim
32 words
The circuit board according to claim 1, wherein the thickness of the marginal portion of the bonding layer spreading outside beyond the edges of the conductive foil is 0.1 mm or below.
Claim 4
Dependent Claim
34 words
A circuit board comprising: an insulating substrate; and a conductive foil bonded to the insulating substrate with a bonding layer; wherein the bonding layer has an area greater than that of the conductive foil.
Claim 5
Dependent Claim
35 words
The circuit board according to claim 4, wherein the marginal portion of the bonding layer spreading outside beyond the edges of the conductive foil has a width greater than the thickness of the bonding layer.
Claim 6
Dependent Claim
32 words
The circuit board according to claim 4, wherein the thickness of the marginal portion of the bonding layer spreading outside beyond the edges of the conductive foil is 0.1 mm or below.
Claim 7
Dependent Claim
46 words
A circuit board comprising: an insulating substrate and a conductive foil bonded to the insulating substrate with a bonding layer; wherein edges of corner portions of a pattern of the bonding layer lie outside corresponding edges of corner portions of the pattern of the conductive foil.
Claim 8
Dependent Claim
47 words
The circuit board according to claim 7, wherein the width of the largest corner portion of the pattern of the bonding layer lying outside the edges of the corresponding corner portion of the pattern of the conductive foil is greater than the thickness of the bonding layer.
Claim 9
Dependent Claim
43 words
The circuit board according to claim 7, wherein the thickness of the largest corner portion of the pattern of the bonding layer lying outside the edges of the corresponding corner portion of the pattern of the conductive foil is 0.1 mm or below.
Claim 10
Dependent Claim
25 words
The circuit board according to claim 1, wherein the conductive foil is bonded to the insulating substrate with a plurality of kinds of bonding layers.
Claim 11
Dependent Claim
33 words
The circuit board according to claim 10, wherein a plurality of kinds of bonding layers the same as those bonding the conductive foil to the insulating substrate are formed on the conductive foil.
Claim 12
Dependent Claim
55 words
A semiconductor device comprising: a metal base plate; an insulating substrate placed on the metal base plate; a conductive foil bonded to the insulating substrate with a bonding layer; and a semiconductor element mounted on the conductive foil; wherein a marginal portion of the bonding layer spreads outside beyond the edges of the conductive foil.
Claim 13
Dependent Claim
35 words
The semiconductor device according to claim 12, wherein the marginal portion of the bonding layer spreading outside beyond the edges of the conductive foil has a width greater than the thickness of the bonding layer.
Claim 14
Dependent Claim
32 words
The semiconductor device according to claim 12, wherein the thickness of the marginal portion of the bonding layer spreading outside beyond the edges of the conductive foil is 0.1 mm or below.
Claim 15
Dependent Claim
52 words
A semiconductor device comprising: a metal base plate; an insulating substrate placed on the metal base plate; a conductive foil bonded to the insulating substrate with a bonding layer; and a semiconductor element mounted on the conductive foil; wherein the bonding layer has an area greater than that of the conductive foil.
Claim 16
Dependent Claim
35 words
The semiconductor device according to claim 15, wherein the marginal portion of the bonding layer spreading outside beyond the edges of the conductive foil has a width greater than the thickness of the bonding layer.
Claim 17
Dependent Claim
32 words
The semiconductor device according to claim 15, wherein the thickness of the marginal portion of the bonding layer spreading outside beyond the edges of the conductive foil is 0.1 mm or below.
Claim 18
Dependent Claim
64 words
A semiconductor device comprising: a metal base plate; an insulating substrate placed on the metal base plate; a conductive foil bonded to the insulating substrate with a bonding layer; and a semiconductor element mounted on the conductive foil; wherein edges of corner portions of a pattern of the bonding layer lie outside corresponding edges of corner portions of the pattern of the conductive foil.
Claim 19
Dependent Claim
47 words
The semiconductor device according to claim 18, wherein the width of the largest corner portion of the pattern of the bonding layer lying outside the edges of the corresponding corner portion of the pattern of the conductive foil is greater than the thickness of the bonding layer.
Claim 20
Dependent Claim
43 words
The semiconductor device according to claim 18, wherein the thickness of the largest corner portion of the pattern of the bonding layer lying outside the edges of the corresponding corner portion of the pattern of the conductive foil is 0.1 mm or below.
Claim 21
Dependent Claim
25 words
The semiconductor device according to claim 12, wherein the conductive foil is bonded to the insulating substrate with a plurality of kinds of bonding layers.
Claim 22
Dependent Claim
33 words
The semiconductor device according to claim 21, wherein a plurality of kinds of bonding layers the same as those bonding the conductive foil to the insulating substrate are formed on the conductive foil.
References Cited (Backward Citations)
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